20240055416. WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME simplified abstract (SJ Semiconductor (Jiangyin) Corporation)
Contents
WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
Organization Name
SJ Semiconductor (Jiangyin) Corporation
Inventor(s)
Chengchung Lin of Jiangyin (CN)
WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240055416 titled 'WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME
Simplified Explanation
The wafer-level packaging structure and method described in this patent application allow for the integration of various electronic chips and components, such as millimeter wave antenna, capacitor, inductor, electric crystal, GPU, PMU, DDR, flash memory, and filter, with higher flexibility and wider compatibility. This integration reduces package size and package cost.
- The wafer-level packaging structure includes a molding layer and a 3D IPD structure fabricated in the molding layer.
- The molding layer serves as a base for integrating electronic chips and components.
- The 3D IPD structure provides a three-dimensional interconnect platform for connecting and routing signals between the integrated chips and components.
- The integration of various electronic chips and components allows for the creation of complex electronic systems on a single wafer-level package.
- The flexibility and compatibility of the wafer-level packaging structure enable the integration of different types of electronic chips and components, regardless of their size or function.
- The reduction in package size and package cost is achieved by eliminating the need for separate packaging for each individual chip or component.
Potential applications of this technology:
- Mobile devices: The wafer-level packaging structure can be used to integrate various components, such as antennas, capacitors, and memory, into a compact package for mobile phones, tablets, and other portable devices.
- Internet of Things (IoT): The integration of different electronic chips and components enables the creation of small and efficient IoT devices with enhanced functionality.
- Automotive electronics: The wafer-level packaging structure can be utilized in the production of automotive electronic systems, allowing for the integration of multiple components in a space-efficient manner.
Problems solved by this technology:
- Package size and cost: The integration of various electronic chips and components into a single wafer-level package reduces the overall size and cost of the package compared to traditional packaging methods.
- Compatibility and flexibility: The wafer-level packaging structure provides compatibility and flexibility in integrating different types of electronic chips and components, eliminating the need for separate packaging for each individual component.
Benefits of this technology:
- Cost reduction: The integration of multiple electronic chips and components into a single package reduces the overall cost of production.
- Space efficiency: The wafer-level packaging structure allows for the creation of compact electronic systems, saving space in devices and applications.
- Enhanced functionality: The integration of various components enables the development of electronic systems with enhanced functionality and performance.
Original Abstract Submitted
a wafer-level packaging structure and a method for preparing the same are provided, the wafer-level packaging structure includes at least a molding layer and a 3d ipd structure fabricated in the molding layer. the wafer-level packaging structure of the present disclosure can integrate various electronic chips and components such as millimeter wave antenna/capacitor/inductor/electric crystal/gpu/pmu/ddr/flash memory/filter, etc., with higher flexibility and wider compatibility, thus reducing package size and package cost.
