18234092. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18234092 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor device, an interposer, a second semiconductor device, and a substrate. The first semiconductor device is placed on the interposer, which is then electrically connected to the second semiconductor device on the substrate.
- The first semiconductor device is mounted on the interposer, which is then connected to the second semiconductor device on the substrate.
- The volume of the first shape, where the first semiconductor device overlaps the substrate, is smaller than the volume of the second shape, where the interposer overlaps the substrate.
Potential Applications
This technology could be applied in the manufacturing of advanced semiconductor packages for various electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This innovation solves the problem of optimizing space utilization in semiconductor packaging, allowing for more efficient and compact electronic devices.
Benefits
The benefits of this technology include improved performance, reduced size, and enhanced functionality of electronic devices due to the efficient arrangement of semiconductor components.
Original Abstract Submitted
A semiconductor package including a first semiconductor device including a semiconductor chip; an interposer including silicon and electrically connected to the first semiconductor device, wherein the first semiconductor is provided on the interposer; a second semiconductor device; and a substrate, wherein the interposer and the second semiconductor device, are provided on the substrate apart from each other, and wherein the interposer is electrically connected to the second semiconductor device; wherein a first volume of a first shape, in which the first semiconductor device overlaps an upper surface of the substrate, is less than or equal to a second volume of a second shape, in which the interposer overlaps an upper surface of the substrate.
