Difference between revisions of "Taiwan Semiconductor Manufacturing Company, Ltd. patent applications published on November 30th, 2023"
Wikipatents (talk | contribs) (Creating a new page) |
Wikipatents (talk | contribs) |
||
Line 1: | Line 1: | ||
+ | '''Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023''' | ||
+ | |||
+ | Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has recently filed several patents related to the formation and structure of memory devices and semiconductor devices. These patents aim to improve the performance, functionality, and efficiency of these devices. | ||
+ | |||
+ | Summary: | ||
+ | - TSMC has filed patents for methods of forming memory devices, semiconductor devices, and magnetic memory devices. | ||
+ | - The methods involve the formation of specific layers, plugs, and structures to enhance the functionality and performance of the devices. | ||
+ | - The patents also describe the use of magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks to improve the operation of the devices. | ||
+ | - TSMC's patents also include methods for etching magnetic tunneling junction structures and creating ultra-large height top electrodes for MRAM devices. | ||
+ | - The organization has also filed patents for semiconductor structures with optical components and thermal control mechanisms. | ||
+ | - Notable applications of these patents include data storage, magnetic sensors, and magnetoresistive random-access memory (MRAM) devices. | ||
+ | |||
+ | Bullet points: | ||
+ | * TSMC has filed patents for memory devices, semiconductor devices, and magnetic memory devices. | ||
+ | * The patents describe methods for forming specific layers, plugs, and structures to enhance device performance. | ||
+ | * Magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks are used in the devices. | ||
+ | * Patents also cover methods for etching magnetic tunneling junction structures and creating large height top electrodes for MRAM devices. | ||
+ | * Semiconductor structures with optical components and thermal control mechanisms are also described. | ||
+ | * Applications include data storage, magnetic sensors, and MRAM devices. | ||
+ | |||
+ | |||
+ | |||
+ | |||
==Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023== | ==Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023== | ||
Revision as of 06:15, 5 December 2023
Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has recently filed several patents related to the formation and structure of memory devices and semiconductor devices. These patents aim to improve the performance, functionality, and efficiency of these devices.
Summary: - TSMC has filed patents for methods of forming memory devices, semiconductor devices, and magnetic memory devices. - The methods involve the formation of specific layers, plugs, and structures to enhance the functionality and performance of the devices. - The patents also describe the use of magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks to improve the operation of the devices. - TSMC's patents also include methods for etching magnetic tunneling junction structures and creating ultra-large height top electrodes for MRAM devices. - The organization has also filed patents for semiconductor structures with optical components and thermal control mechanisms. - Notable applications of these patents include data storage, magnetic sensors, and magnetoresistive random-access memory (MRAM) devices.
Bullet points:
- TSMC has filed patents for memory devices, semiconductor devices, and magnetic memory devices.
- The patents describe methods for forming specific layers, plugs, and structures to enhance device performance.
- Magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks are used in the devices.
- Patents also cover methods for etching magnetic tunneling junction structures and creating large height top electrodes for MRAM devices.
- Semiconductor structures with optical components and thermal control mechanisms are also described.
- Applications include data storage, magnetic sensors, and MRAM devices.
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023
- 1.1 PARTICLE REMOVER AND METHOD (18448963)
- 1.2 DEVICE FOR FORMING CONDUCTIVE POWDER (18447161)
- 1.3 POLISHING METROLOGY (17898163)
- 1.4 MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST ANTI-STICTION/OUTGASSING STRUCTURE (18364702)
- 1.5 MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE (18446741)
- 1.6 WIRE-BOND DAMPER FOR SHOCK ABSORPTION (18446740)
- 1.7 DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE (17825225)
- 1.8 SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL (18447543)
- 1.9 TEMPERATURE SENSOR CIRCUITS AND CONTROL CIRCUITS AND METHOD FOR TEMPERATURE SENSOR CIRCUITS (18150772)
- 1.10 TEMPERATURE SENSING BASED ON METAL RAILS WITH DIFFERENT THERMAL-RESISTANCE COEFFICIENTS (18170401)
- 1.11 METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE (18362983)
- 1.12 FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME (18448032)
- 1.13 METHOD OF MAKING PHOTONIC DEVICE (18448046)
- 1.14 METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING (18448095)
- 1.15 METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING (18358790)
- 1.16 PELLICLE FOR AN EUV LITHOGRAPHY MASK AND A METHOD OF MANUFACTURING THEREOF (18232674)
- 1.17 PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME (18362046)
- 1.18 PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (18232264)
- 1.19 PHOTORESIST MATERIALS AND ASSOCIATED METHODS (18447568)
- 1.20 PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN (18232225)
- 1.21 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232220)
- 1.22 UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232774)
- 1.23 PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN (18232717)
- 1.24 SYSTEM AND METHOD FOR SUPPLYING AND DISPENSING BUBBLE-FREE PHOTOLITHOGRAPHY CHEMICAL SOLUTIONS (18365529)
- 1.25 METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR (18358904)
- 1.26 SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (18446870)
- 1.27 OPTIMIZED MASK STITCHING (18231070)
- 1.28 ENHANCING LITHOGRAPHY OPERATION FOR MANUFACTURING SEMICONDUCTOR DEVICES (18232745)
- 1.29 MODULE VESSEL WITH SCRUBBER GUTTERS SIZED TO PREVENT OVERFLOW (18447361)
- 1.30 SEMICONDUCTOR WAFER COOLING (18362037)
- 1.31 MEMORY ADDRESS PROTECTION CIRCUIT AND METHOD OF OPERATING SAME (18355222)
- 1.32 FAULT DIAGNOSTICS (18303219)
- 1.33 INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17821559)
- 1.34 METHOD FOR CHIP INTEGRATION (17828648)
- 1.35 SEMICONDUCTOR DEVICE (18361815)
- 1.36 ANTI-FUSE ARRAY (18446684)
- 1.37 INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME (18446771)
- 1.38 METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS (18447964)
- 1.39 SILICON PHOTONICS SYSTEM (18155980)
- 1.40 INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (18354377)
- 1.41 TRANSMISSION GATE STRUCTURE (18362195)
- 1.42 SYSTEM AND METHOD FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING ARRANGEMENT (18448143)
- 1.43 NEUROMORPHIC COMPUTING DEVICE WITH THREE-DIMENSIONAL MEMORY (17824306)
- 1.44 MEMORY DEVICE WITH SOURCE LINE CONTROL (18232542)
- 1.45 Systems and Methods for Controlling Power Management Operations in a Memory Device (18446818)
- 1.46 ARRANGEMENTS OF MEMORY DEVICES AND METHODS OF OPERATING THE MEMORY DEVICES (18446072)
- 1.47 FIRST FIRE OPERATION FOR OVONIC THRESHOLD SWITCH SELECTOR (17826180)
- 1.48 MEMORY DEVICE WITH REDUCED AREA (17752662)
- 1.49 THREE-DIMENSIONAL ONE TIME PROGRAMMABLE MEMORY (18232539)
- 1.50 NON-VOLATILE MEMORY CIRCUIT AND METHOD (18448152)
- 1.51 FOCUS RING FOR A PLASMA-BASED SEMICONDUCTOR PROCESSING TOOL (18447410)
- 1.52 DEVICE FOR ADJUSTING POSITION OF CHAMBER AND PLASMA PROCESS CHAMBER INCLUDING THE SAME FOR SEMICONDUCTOR MANUFACTURING (18231165)
- 1.53 SEMICONDUCTOR TOOL FOR COPPER DEPOSITION (18447557)
- 1.54 METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS (18225576)
- 1.55 SEMICONDUCTOR DEVICE PRE-CLEANING (17804447)
- 1.56 APPARATUS FOR ELECTRO-CHEMICAL PLATING (18231196)
- 1.57 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (17829154)
- 1.58 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (18232758)
- 1.59 METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL (18447810)
- 1.60 NITRIDE-CONTAINING STI LINER FOR SIGE CHANNEL (18446652)
- 1.61 CHEMICAL DISPENSING SYSTEM (18447353)
- 1.62 SYSTEMS AND METHODS FOR AIR FLOW OPTIMIZATION IN ENVIRONMENT FOR SEMICONDUCTOR DEVICE (18358517)
- 1.63 SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF (18446549)
- 1.64 ETCH METHOD FOR INTERCONNECT STRUCTURE (18447134)
- 1.65 LOCAL INTERCONNECT (18447549)
- 1.66 SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME (18230338)
- 1.67 METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES (17825307)
- 1.68 METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH (17825678)
- 1.69 GATE CONTACT STRUCTURE (18446326)
- 1.70 METAL GATE PROCESS AND RELATED STRUCTURE (17804146)
- 1.71 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION (18360814)
- 1.72 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (18361501)
- 1.73 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18447125)
- 1.74 SEMICONDUCTOR DEVICE STRUCTURE WITH SOURCE/DRAIN STRUCTURE AND METHOD FOR FORMING THE SAME (17824249)
- 1.75 REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES (18359747)
- 1.76 HIGH-K DIELECTRIC MATERIALS WITH DIPOLE LAYER (18447239)
- 1.77 METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (17824263)
- 1.78 MANUFACTURING PROCESS WITH ATOMIC LEVEL INSPECTION (18359206)
- 1.79 SYSTEMS AND METHODS OF TESTING MEMORY DEVICES (18232518)
- 1.80 SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE (18232520)
- 1.81 MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (18363742)
- 1.82 STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE (18446076)
- 1.83 SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING (18447927)
- 1.84 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17827992)
- 1.85 INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME (17829243)
- 1.86 VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS (17825336)
- 1.87 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18361917)
- 1.88 Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via (18447871)
- 1.89 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18359864)
- 1.90 SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH (18232523)
- 1.91 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18363766)
- 1.92 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446873)
- 1.93 BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE (18447722)
- 1.94 SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING (17825698)
- 1.95 SOURCE/DRAIN ISOLATION STRUCTURE, LAYOUT, AND METHOD (17752704)
- 1.96 DIAGONAL VIA STRUCTURE (18448125)
- 1.97 SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT (18232306)
- 1.98 ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY (18446025)
- 1.99 FIRST METAL STRUCTURE, LAYOUT, AND METHOD (17752737)
- 1.100 POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS (18361666)
- 1.101 METHOD OF MANUFACTURING INTEGRATED CIRCUIT (18447572)
- 1.102 CELL STRUCTURE WITH INTERMEDIATE METAL LAYERS FOR POWER SUPPLIES (18448005)
- 1.103 METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING BURIED CONDUCTIVE FINGERS (18448028)
- 1.104 INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT (18360012)
- 1.105 INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS (17825345)
- 1.106 SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RESISTANCE (17825741)
- 1.107 SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF (17823063)
- 1.108 SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION (17824353)
- 1.109 SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME (18230999)
- 1.110 SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOSED SOLDER BUMPS (17824330)
- 1.111 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18361953)
- 1.112 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING STAGGERED GATE-STUB-SIZE PROFILE AND SYSTEM FOR SAME (18447979)
- 1.113 SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP AND METHOD FOR FORMING THE SAME (17826604)
- 1.114 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (18229682)
- 1.115 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18362862)
- 1.116 INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17828981)
- 1.117 LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE (18366831)
- 1.118 METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE (18360214)
- 1.119 IMAGE SENSOR WITH A HIGH ABSORPTION LAYER (18364662)
- 1.120 PIXEL SENSOR INCLUDING A TRANSFER FINFET (18447340)
- 1.121 EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR (18364667)
- 1.122 IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION (18446572)
- 1.123 METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY (18360966)
- 1.124 OPTICAL BIOSENSOR DEVICE WITH OPTICAL SIGNAL ENHANCEMENT STRUCTURE (17824183)
- 1.125 BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR (18364682)
- 1.126 DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR (18364734)
- 1.127 INDUCTIVE DEVICE (18447482)
- 1.128 Resistor Structure (18358557)
- 1.129 A MULTI-LAYERED RESISTOR WITH A TIGHT TEMPERATURE COEFFICIENT OF RESISTANCE TOLERANCE (18366156)
- 1.130 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17824436)
- 1.131 SUPER JUNCTION STRUCTURE (18448013)
- 1.132 NOVEL SOI DEVICE STRUCTURE FOR ROBUST ISOLATION (18232545)
- 1.133 SOURCE/DRAIN SPACER WITH AIR GAP IN SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME (18366210)
- 1.134 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (17824329)
- 1.135 GALLIUM NITRIDE DRAIN STRUCTURES AND METHODS OF FORMING THE SAME (17804751)
- 1.136 EPITAXIAL SOURCE/DRAIN STRUCTURE WITH HIGH DOPANT CONCENTRATION (17824915)
- 1.137 INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE (18363077)
- 1.138 SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF (17752211)
- 1.139 Semiconductor Gate-All-Around Device (18360080)
- 1.140 PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS (18361262)
- 1.141 SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER (18446864)
- 1.142 SEMICONDUCTOR DEVICES WITH BACKSIDE VIA AND METHODS THEREOF (18360085)
- 1.143 SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION (18447344)
- 1.144 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES (17752461)
- 1.145 SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME (17825411)
- 1.146 SOURCE/DRAIN SILICIDE FOR MULTIGATE DEVICE PERFORMANCE AND METHOD OF FABRICATING THEREOF (18447183)
- 1.147 SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF (17804125)
- 1.148 Spacer Structures for Nano-Sheet-Based Devices (18446733)
- 1.149 3D CAPACITOR AND METHOD OF MANUFACTURING SAME (18366596)
- 1.150 GATE PROFILE MODULATION FOR SEMICONDUCTOR DEVICE (17824690)
- 1.151 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17826174)
- 1.152 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (18232289)
- 1.153 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18232544)
- 1.154 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18447489)
- 1.155 INTEGRATION OF P-CHANNEL AND N-CHANNEL E-FET III-V DEVICES WITH OPTIMIZATION OF DEVICE PERFORMANCE (18364679)
- 1.156 FERROELECTRIC FIELD EFFECT TRANSISTOR AND METHODS OF FORMING THE SAME (17827755)
- 1.157 METHOD OF FABRICATING A SOURCE/DRAIN RECESS IN A SEMICONDUCTOR DEVICE (18446539)
- 1.158 HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION (17804438)
- 1.159 ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS (18446664)
- 1.160 SEMICONDUCTOR DEVICE HAVING ISOLATION STRUCTURE TO REDUCE CURRENT LEAKAGE (17824669)
- 1.161 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (17825516)
- 1.162 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (18359690)
- 1.163 METHOD OF MAKING DECOUPLING CAPACITOR (18447194)
- 1.164 SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS (17827251)
- 1.165 DECOUPLING FINFET CAPACITORS (18358464)
- 1.166 VOLTAGE AMPLIFIER BASED ON CASCADED CHARGE PUMP BOOSTING (18446031)
- 1.167 CLOCK GATING CIRCUIT AND METHOD OF OPERATING THE SAME (18362916)
- 1.168 DATA RETENTION CIRCUIT AND METHOD (18363192)
- 1.169 Flip Flop Circuit (18366981)
- 1.170 SYSTEM AND SEMICONDUCTOR DEVICE THEREIN (17828834)
- 1.171 POST-DRIVER WITH LOW VOLTAGE OPERATION AND ELECTROSTATIC DISCHARGE PROTECTION (17828581)
- 1.172 Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18446849)
- 1.173 Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18447372)
- 1.174 Systems and Methods for Phase Locked Loop Realignment With Skew Cancellation (18446881)
- 1.175 Programmable Regulator Voltage Controlled Ring Oscillator (18366742)
- 1.176 Circuits and Methods for a Noise Shaping Analog To Digital Converter (18361949)
- 1.177 METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE (18361816)
- 1.178 EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY (18231017)
- 1.179 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17826225)
- 1.180 IC INCLUDING STANDARD CELLS AND SRAM CELLS (18361185)
- 1.181 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446094)
- 1.182 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17828123)
- 1.183 MEMORY DEVICES AND METHODS FOR OPERATING THE SAME (17752580)
- 1.184 MEMORY DEVICE WITH IMPROVED ANTI-FUSE READ CURRENT (18447638)
- 1.185 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18361249)
- 1.186 MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (18446582)
- 1.187 FERROELECTRIC-BASED MEMORY DEVICE AND METHOD OF FORMING THE SAME (18181229)
- 1.188 MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18361548)
- 1.189 THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18446894)
- 1.190 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME (18358966)
- 1.191 MEMORY CELL ISOLATION (17826100)
- 1.192 EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR (18446557)
- 1.193 METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE (17825440)
- 1.194 METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE (18448100)
- 1.195 SELF-ALIGNED ENCAPSULATION HARD MASK TO SEPARATE PHYSICALLY UNDER-ETCHED MTJ CELLS TO REDUCE CONDUCTIVE RE-DEPOSITION (18232027)
- 1.196 Metal/Dielectric/Metal Hybrid Hard Mask To Define Ultra-Large Height Top Electrode For Sub 60nm MRAM Devices (18361677)
- 1.197 MEMORY DEVICE AND METHOD OF FABRICATING THE SAME (17827998)
- 1.198 MAGNETIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (17900892)
- 1.199 SIDEWALL SPACER STRUCTURE FOR MEMORY CELL (18364697)
- 1.200 STRUCTURE AND METHOD FOR MRAM DEVICES (18446563)
- 1.201 MEMORY DEVICE STRUCTURE WITH DATA STORAGE ELEMENT (18358685)
- 1.202 METHODS OF FORMING MEMORY DEVICES (18363751)
Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023
PARTICLE REMOVER AND METHOD (18448963)
Main Inventor
Wen-Hao Cheng
DEVICE FOR FORMING CONDUCTIVE POWDER (18447161)
Main Inventor
You-Hua CHOU
POLISHING METROLOGY (17898163)
Main Inventor
Chih Hung CHEN
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST ANTI-STICTION/OUTGASSING STRUCTURE (18364702)
Main Inventor
Kuei-Sung Chang
MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE (18446741)
Main Inventor
Chun-Wen Cheng
WIRE-BOND DAMPER FOR SHOCK ABSORPTION (18446740)
Main Inventor
Tsung-Lin Hsieh
DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE (17825225)
Main Inventor
Wen-Chuan Tai
SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL (18447543)
Main Inventor
Yi-Lin WANG
TEMPERATURE SENSOR CIRCUITS AND CONTROL CIRCUITS AND METHOD FOR TEMPERATURE SENSOR CIRCUITS (18150772)
Main Inventor
Jaw-Juinn HORNG
TEMPERATURE SENSING BASED ON METAL RAILS WITH DIFFERENT THERMAL-RESISTANCE COEFFICIENTS (18170401)
Main Inventor
Szu-Lin Liu
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE (18362983)
Main Inventor
Feng-Wei KUO
FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME (18448032)
Main Inventor
Chen-Hao HUANG
METHOD OF MAKING PHOTONIC DEVICE (18448046)
Main Inventor
Chien-Ying WU
METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING (18448095)
Main Inventor
Sui-Ying HSU
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING (18358790)
Main Inventor
Yu-Hao CHEN
PELLICLE FOR AN EUV LITHOGRAPHY MASK AND A METHOD OF MANUFACTURING THEREOF (18232674)
Main Inventor
Yun-Yue LIN
PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME (18362046)
Main Inventor
Kuo-Hao LEE
PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (18232264)
Main Inventor
An-Ren ZI
PHOTORESIST MATERIALS AND ASSOCIATED METHODS (18447568)
Main Inventor
Ming-Hui WENG
PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN (18232225)
Main Inventor
An-Ren Zi
PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232220)
Main Inventor
Yen-Hao CHEN
UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232774)
Main Inventor
Ming-Hui WENG
PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN (18232717)
Main Inventor
An-Ren ZI
SYSTEM AND METHOD FOR SUPPLYING AND DISPENSING BUBBLE-FREE PHOTOLITHOGRAPHY CHEMICAL SOLUTIONS (18365529)
Main Inventor
Wen-Zhan Zhou
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR (18358904)
Main Inventor
Hung-Jui Kuo
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (18446870)
Main Inventor
Kai-Chieh CHANG
OPTIMIZED MASK STITCHING (18231070)
Main Inventor
Sagar TRIVEDI
ENHANCING LITHOGRAPHY OPERATION FOR MANUFACTURING SEMICONDUCTOR DEVICES (18232745)
Main Inventor
Yih-Chen SU
MODULE VESSEL WITH SCRUBBER GUTTERS SIZED TO PREVENT OVERFLOW (18447361)
Main Inventor
Chun-Kai CHANG
SEMICONDUCTOR WAFER COOLING (18362037)
Main Inventor
Yung-Yao LEE
MEMORY ADDRESS PROTECTION CIRCUIT AND METHOD OF OPERATING SAME (18355222)
Main Inventor
Saman M. I. ADHAM
FAULT DIAGNOSTICS (18303219)
Main Inventor
Sandeep Kumar Goel
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17821559)
Main Inventor
Johnny Chiahao LI
METHOD FOR CHIP INTEGRATION (17828648)
Main Inventor
Yung Feng Chang
SEMICONDUCTOR DEVICE (18361815)
Main Inventor
Yu-Jen CHEN
ANTI-FUSE ARRAY (18446684)
Main Inventor
Meng-Sheng CHANG
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME (18446771)
Main Inventor
Yu-Jung CHANG
METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS (18447964)
Main Inventor
Yen-Pin CHEN
SILICON PHOTONICS SYSTEM (18155980)
Main Inventor
Feng-Wei KUO
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (18354377)
Main Inventor
John LIN
TRANSMISSION GATE STRUCTURE (18362195)
Main Inventor
Shao-Lun CHIEN
SYSTEM AND METHOD FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING ARRANGEMENT (18448143)
Main Inventor
Fong-Yuan CHANG
NEUROMORPHIC COMPUTING DEVICE WITH THREE-DIMENSIONAL MEMORY (17824306)
Main Inventor
Chieh Lee
MEMORY DEVICE WITH SOURCE LINE CONTROL (18232542)
Main Inventor
Perng-Fei Yuh
Systems and Methods for Controlling Power Management Operations in a Memory Device (18446818)
Main Inventor
Sanjeev Kumar Jain
ARRANGEMENTS OF MEMORY DEVICES AND METHODS OF OPERATING THE MEMORY DEVICES (18446072)
Main Inventor
Chien-Yuan Chen
FIRST FIRE OPERATION FOR OVONIC THRESHOLD SWITCH SELECTOR (17826180)
Main Inventor
Elia Ambrosi
MEMORY DEVICE WITH REDUCED AREA (17752662)
Main Inventor
Chun-Ying Lee
THREE-DIMENSIONAL ONE TIME PROGRAMMABLE MEMORY (18232539)
Main Inventor
Meng-Sheng Chang
NON-VOLATILE MEMORY CIRCUIT AND METHOD (18448152)
Main Inventor
Gu-Huan LI
FOCUS RING FOR A PLASMA-BASED SEMICONDUCTOR PROCESSING TOOL (18447410)
Main Inventor
Sheng-Chieh HUANG
DEVICE FOR ADJUSTING POSITION OF CHAMBER AND PLASMA PROCESS CHAMBER INCLUDING THE SAME FOR SEMICONDUCTOR MANUFACTURING (18231165)
Main Inventor
Ming Che CHEN
SEMICONDUCTOR TOOL FOR COPPER DEPOSITION (18447557)
Main Inventor
Chia-Hung TSAI
METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS (18225576)
Main Inventor
Wei-Lin CHANG
SEMICONDUCTOR DEVICE PRE-CLEANING (17804447)
Main Inventor
Yi-Hsiang CHAO
APPARATUS FOR ELECTRO-CHEMICAL PLATING (18231196)
Main Inventor
Kuo-Lung HOU
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (17829154)
Main Inventor
Po-Han LIN
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (18232758)
Main Inventor
Chun-Wei LIAO
METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL (18447810)
Main Inventor
Yun-Jui HE
NITRIDE-CONTAINING STI LINER FOR SIGE CHANNEL (18446652)
Main Inventor
Ya-Wen Chiu
CHEMICAL DISPENSING SYSTEM (18447353)
Main Inventor
Ming-Chieh HSU
SYSTEMS AND METHODS FOR AIR FLOW OPTIMIZATION IN ENVIRONMENT FOR SEMICONDUCTOR DEVICE (18358517)
Main Inventor
Yi-Fam Shiu
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF (18446549)
Main Inventor
Soon-Kang HUANG
ETCH METHOD FOR INTERCONNECT STRUCTURE (18447134)
Main Inventor
Chun-Cheng Chou
LOCAL INTERCONNECT (18447549)
Main Inventor
Cheng-Hsien Wu
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME (18230338)
Main Inventor
Ting-Ya LO
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES (17825307)
Main Inventor
Yu-Chen KO
METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH (17825678)
Main Inventor
Chung-Liang CHENG
GATE CONTACT STRUCTURE (18446326)
Main Inventor
Cheng-Chi Chuang
METAL GATE PROCESS AND RELATED STRUCTURE (17804146)
Main Inventor
Chih-Lun LU
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION (18360814)
Main Inventor
Osamu KOIKE
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (18361501)
Main Inventor
Chung-Ting KO
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18447125)
Main Inventor
Shu-Uei Jang
SEMICONDUCTOR DEVICE STRUCTURE WITH SOURCE/DRAIN STRUCTURE AND METHOD FOR FORMING THE SAME (17824249)
Main Inventor
Ta-Chun LIN
REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES (18359747)
Main Inventor
Yu-Jen Shen
HIGH-K DIELECTRIC MATERIALS WITH DIPOLE LAYER (18447239)
Main Inventor
Huiching Chang
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (17824263)
Main Inventor
Chih-Hsin Yang
MANUFACTURING PROCESS WITH ATOMIC LEVEL INSPECTION (18359206)
Main Inventor
I-Che Lee
SYSTEMS AND METHODS OF TESTING MEMORY DEVICES (18232518)
Main Inventor
Meng-Han Lin
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE (18232520)
Main Inventor
Tsung-Yang Hsieh
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (18363742)
Main Inventor
Meng-Liang Lin
STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE (18446076)
Main Inventor
Jen-Yuan CHANG
SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING (18447927)
Main Inventor
Jian WU
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17827992)
Main Inventor
Wei-Ming Wang
INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME (17829243)
Main Inventor
Chang-Jung HSUEH
VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS (17825336)
Main Inventor
Ting-Yu Yeh
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18361917)
Main Inventor
Jen-Chun Liao
Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via (18447871)
Main Inventor
Yung-Chi Lin
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18359864)
Main Inventor
Ting-Yu Yeh
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH (18232523)
Main Inventor
Yueh-Ting Lin
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18363766)
Main Inventor
Chien-Hung Chen
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446873)
Main Inventor
Chung-Ting Lu
BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE (18447722)
Main Inventor
Tsung-Chieh Hsiao
SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING (17825698)
Main Inventor
Chih-Yu Lu
SOURCE/DRAIN ISOLATION STRUCTURE, LAYOUT, AND METHOD (17752704)
Main Inventor
Chi-Yu LU
DIAGONAL VIA STRUCTURE (18448125)
Main Inventor
Shih-Wei PENG
SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT (18232306)
Main Inventor
Gerben DOORNBOS
ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY (18446025)
Main Inventor
Shih-Wei Peng
FIRST METAL STRUCTURE, LAYOUT, AND METHOD (17752737)
Main Inventor
Chi-Yu LU
POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS (18361666)
Main Inventor
Chih-Liang CHEN
METHOD OF MANUFACTURING INTEGRATED CIRCUIT (18447572)
Main Inventor
Chih-Yu LAI
CELL STRUCTURE WITH INTERMEDIATE METAL LAYERS FOR POWER SUPPLIES (18448005)
Main Inventor
Li-Chun Tien
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING BURIED CONDUCTIVE FINGERS (18448028)
Main Inventor
Chih-Liang CHEN
INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT (18360012)
Main Inventor
Shin-Yi Yang
INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS (17825345)
Main Inventor
Chien Hung Liu
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RESISTANCE (17825741)
Main Inventor
Hsi-Wen TIEN
SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF (17823063)
Main Inventor
Sheng-Fan YANG
SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION (17824353)
Main Inventor
Shu-Chun Yang
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME (18230999)
Main Inventor
Cheng-Chieh HSIEH
SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOSED SOLDER BUMPS (17824330)
Main Inventor
Fong-yuan Chang
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18361953)
Main Inventor
Chung-Liang CHENG
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING STAGGERED GATE-STUB-SIZE PROFILE AND SYSTEM FOR SAME (18447979)
Main Inventor
Te-Hsin CHIU
SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP AND METHOD FOR FORMING THE SAME (17826604)
Main Inventor
Yi-Ruei JHAN
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (18229682)
Main Inventor
Jui-Chien HUANG
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18362862)
Main Inventor
Yu-Lien HUANG
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17828981)
Main Inventor
Chin-Wei HSU
LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE (18366831)
Main Inventor
Harry-Hak-Lay Chuang
METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE (18360214)
Main Inventor
Ming Chyi Liu
IMAGE SENSOR WITH A HIGH ABSORPTION LAYER (18364662)
Main Inventor
Chien-Chang Huang
PIXEL SENSOR INCLUDING A TRANSFER FINFET (18447340)
Main Inventor
Feng-Chien HSIEH
EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR (18364667)
Main Inventor
Shih-Hsun Hsu
IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION (18446572)
Main Inventor
Hsiang-Lin Chen
METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY (18360966)
Main Inventor
Tsun-Kai Tsao
OPTICAL BIOSENSOR DEVICE WITH OPTICAL SIGNAL ENHANCEMENT STRUCTURE (17824183)
Main Inventor
Yi-Hsien Chang
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR (18364682)
Main Inventor
Cheng-Ta Wu
DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR (18364734)
Main Inventor
Feng-Chien HSIEH
INDUCTIVE DEVICE (18447482)
Main Inventor
Wei-Yu CHOU
Resistor Structure (18358557)
Main Inventor
Chih-Fan Huang
A MULTI-LAYERED RESISTOR WITH A TIGHT TEMPERATURE COEFFICIENT OF RESISTANCE TOLERANCE (18366156)
Main Inventor
Szu-Hsien Lo
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17824436)
Main Inventor
Tsung-Chieh HSIAO
SUPER JUNCTION STRUCTURE (18448013)
Main Inventor
Shuai ZHANG
NOVEL SOI DEVICE STRUCTURE FOR ROBUST ISOLATION (18232545)
Main Inventor
Lin-Chen Lu
SOURCE/DRAIN SPACER WITH AIR GAP IN SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME (18366210)
Main Inventor
Ko-Cheng Liu
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (17824329)
Main Inventor
Lin-Yu HUANG
GALLIUM NITRIDE DRAIN STRUCTURES AND METHODS OF FORMING THE SAME (17804751)
Main Inventor
Chi-Ming CHEN
EPITAXIAL SOURCE/DRAIN STRUCTURE WITH HIGH DOPANT CONCENTRATION (17824915)
Main Inventor
Chih Sheng Huang
INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE (18363077)
Main Inventor
Hsin Fu Lin
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF (17752211)
Main Inventor
Jui-Lin CHANG
Semiconductor Gate-All-Around Device (18360080)
Main Inventor
Jhon Jhy Liaw
PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS (18361262)
Main Inventor
Meng-Huan Jao
SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER (18446864)
Main Inventor
Shih-Chuan Chiu
SEMICONDUCTOR DEVICES WITH BACKSIDE VIA AND METHODS THEREOF (18360085)
Main Inventor
Po-Yu Huang
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION (18447344)
Main Inventor
Te-Chih HSIUNG
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES (17752461)
Main Inventor
Yung-Hsiang CHAN
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME (17825411)
Main Inventor
Shin-Yi YANG
SOURCE/DRAIN SILICIDE FOR MULTIGATE DEVICE PERFORMANCE AND METHOD OF FABRICATING THEREOF (18447183)
Main Inventor
Chih-Ching Wang
SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF (17804125)
Main Inventor
Wen-Shun LO
Spacer Structures for Nano-Sheet-Based Devices (18446733)
Main Inventor
Shih-Cheng Chen
3D CAPACITOR AND METHOD OF MANUFACTURING SAME (18366596)
Main Inventor
Chi-Wen LIU
GATE PROFILE MODULATION FOR SEMICONDUCTOR DEVICE (17824690)
Main Inventor
Tien-Shun CHANG
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17826174)
Main Inventor
Wang-Chun Huang
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (18232289)
Main Inventor
Chia-Chi YU
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18232544)
Main Inventor
Shih-Yao LIN
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18447489)
Main Inventor
Wei-Chih KAO
INTEGRATION OF P-CHANNEL AND N-CHANNEL E-FET III-V DEVICES WITH OPTIMIZATION OF DEVICE PERFORMANCE (18364679)
Main Inventor
Man-Ho Kwan
FERROELECTRIC FIELD EFFECT TRANSISTOR AND METHODS OF FORMING THE SAME (17827755)
Main Inventor
Gerben Doornbos
METHOD OF FABRICATING A SOURCE/DRAIN RECESS IN A SEMICONDUCTOR DEVICE (18446539)
Main Inventor
Eric PENG
HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION (17804438)
Main Inventor
Jhu-Min SONG
ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS (18446664)
Main Inventor
Shi Ning Ju
SEMICONDUCTOR DEVICE HAVING ISOLATION STRUCTURE TO REDUCE CURRENT LEAKAGE (17824669)
Main Inventor
Hung-Yu YEN
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (17825516)
Main Inventor
Shuen-Shin LIANG
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (18359690)
Main Inventor
Marcus Johannes Henricus VAN DAL
METHOD OF MAKING DECOUPLING CAPACITOR (18447194)
Main Inventor
Szu-Lin LIU
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS (17827251)
Main Inventor
Po-Chia Lai
DECOUPLING FINFET CAPACITORS (18358464)
Main Inventor
Chung-Hui Chen
VOLTAGE AMPLIFIER BASED ON CASCADED CHARGE PUMP BOOSTING (18446031)
Main Inventor
Chin-Ho Chang
CLOCK GATING CIRCUIT AND METHOD OF OPERATING THE SAME (18362916)
Main Inventor
Seid Hadi RASOULI
DATA RETENTION CIRCUIT AND METHOD (18363192)
Main Inventor
Kai-Chi HUANG
Flip Flop Circuit (18366981)
Main Inventor
Po-Chia Lai
SYSTEM AND SEMICONDUCTOR DEVICE THEREIN (17828834)
Main Inventor
Tsung-Che LU
POST-DRIVER WITH LOW VOLTAGE OPERATION AND ELECTROSTATIC DISCHARGE PROTECTION (17828581)
Main Inventor
Chin-Hua Wen
Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18446849)
Main Inventor
Jerrin Pathrose Vareed
Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18447372)
Main Inventor
Jerrin Pathrose Vareed
Systems and Methods for Phase Locked Loop Realignment With Skew Cancellation (18446881)
Main Inventor
Tsung-Hsien Tsai
Programmable Regulator Voltage Controlled Ring Oscillator (18366742)
Main Inventor
Tsung-Hsien Tsai
Circuits and Methods for a Noise Shaping Analog To Digital Converter (18361949)
Main Inventor
Martin Kinyua
METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE (18361816)
Main Inventor
En-Hsiang YEH
EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY (18231017)
Main Inventor
Shang-Chieh CHIEN
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17826225)
Main Inventor
Chun-Hung CHEN
IC INCLUDING STANDARD CELLS AND SRAM CELLS (18361185)
Main Inventor
Jhon-Jhy LIAW
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446094)
Main Inventor
Shih-Yao Lin
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17828123)
Main Inventor
Jhon-Jhy LIAW
MEMORY DEVICES AND METHODS FOR OPERATING THE SAME (17752580)
Main Inventor
Hsiang-Wei Liu
MEMORY DEVICE WITH IMPROVED ANTI-FUSE READ CURRENT (18447638)
Main Inventor
Meng-Sheng CHANG
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18361249)
Main Inventor
Meng-Han Lin
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (18446582)
Main Inventor
Feng-Ching Chu
FERROELECTRIC-BASED MEMORY DEVICE AND METHOD OF FORMING THE SAME (18181229)
Main Inventor
Yi-Hsuan Chen
MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18361548)
Main Inventor
Meng-Han Lin
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18446894)
Main Inventor
Meng-Han Lin
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME (18358966)
Main Inventor
Gerben Doornbos
MEMORY CELL ISOLATION (17826100)
Main Inventor
Tzu-Yu Chen
EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR (18446557)
Main Inventor
Kuan-Liang Liu
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE (17825440)
Main Inventor
Wei-Chih WEN
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE (18448100)
Main Inventor
Yu-Hao CHEN
SELF-ALIGNED ENCAPSULATION HARD MASK TO SEPARATE PHYSICALLY UNDER-ETCHED MTJ CELLS TO REDUCE CONDUCTIVE RE-DEPOSITION (18232027)
Main Inventor
Yi Yang
Metal/Dielectric/Metal Hybrid Hard Mask To Define Ultra-Large Height Top Electrode For Sub 60nm MRAM Devices (18361677)
Main Inventor
Yi Yang
MEMORY DEVICE AND METHOD OF FABRICATING THE SAME (17827998)
Main Inventor
Yen-Lin Huang
MAGNETIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (17900892)
Main Inventor
Ming-Yuan Song
SIDEWALL SPACER STRUCTURE FOR MEMORY CELL (18364697)
Main Inventor
Yao-Wen Chang
STRUCTURE AND METHOD FOR MRAM DEVICES (18446563)
Main Inventor
Tsung-Chieh Hsiao
MEMORY DEVICE STRUCTURE WITH DATA STORAGE ELEMENT (18358685)
Main Inventor
Hai-Dang TRINH
METHODS OF FORMING MEMORY DEVICES (18363751)
Main Inventor
Hung-Li Chiang