US Patent Application 18448125. DIAGONAL VIA STRUCTURE simplified abstract

DIAGONAL VIA STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Shih-Wei Peng of Hsinchu (TW)]]

[[Category:Chih-Min Hsiao of Hsinchu (TW)]]

[[Category:Ching-Hsu Chang of Hsinchu (TW)]]

[[Category:Jiann-Tyng Tzeng of Hsinchu (TW)]]

DIAGONAL VIA STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18448125 titled 'DIAGONAL VIA STRUCTURE

Simplified Explanation

The patent application describes an integrated circuit structure that includes metal segments and via structures to connect them.

• The structure consists of first metal segments in a first metal layer and second metal segments in a second metal layer.
• The first metal segments correspond to first tracks, while the second metal segments correspond to second tracks that are perpendicular to the first tracks.
• Via structures are used to electrically connect the first metal segments to the second metal segments.
• The intersections of the first and second tracks create a grid with diagonal grid lines.
• The first plurality of diagonal grid lines includes at least three via structures positioned at contiguous intersection locations.
• The second plurality of diagonal grid lines does not include any via structures.

Original Abstract Submitted

An integrated circuit (IC) structure includes a plurality of first metal segments in a first metal layer of a semiconductor substrate, the plurality of first metal segments corresponding to first tracks, a plurality of second metal segments in a second metal layer of the semiconductor substrate adjacent to the first metal layer, the plurality of second metal segments corresponding to second tracks perpendicular to the first tracks, and a plurality of via structures configured to electrically connect the plurality of first metal segments to the plurality of second metal segments. Locations of intersections of the first and second tracks define a grid including a first plurality of diagonal grid lines alternating with a second plurality of diagonal grid lines, the first plurality of diagonal grid lines includes at least three via structures of the plurality of via structures positioned at contiguous intersection locations, and the second plurality of diagonal grid lines is free from including a via structure of the plurality of via structures.