US Patent Application 18230999. SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME simplified abstract

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Cheng-Chieh Hsieh of Tainan (TW)]]

[[Category:Hau Tao of Hsinchu City (TW)]]

[[Category:Yung-Tien Kuo of Hsinchu City (TW)]]

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18230999 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

Simplified Explanation

The patent application describes a semiconductor device that includes an interposer placed on a substrate.

• The interposer has two major surfaces, with the first one facing the substrate and the second one facing opposite to the first.
• A system on a chip is placed on the second major surface of the interposer.
• The first major surface of the interposer contains a plurality of first passive devices.
• The second major surface of the interposer contains a plurality of second passive devices.
• The second passive devices are different from the first passive devices.

Original Abstract Submitted

A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.