US Patent Application 18225576. METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS simplified abstract
Contents
METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==
[[Category:Wei-Lin Chang of Hsinchu (TW)]]
[[Category:Chih-Chien Wang of Hsinchu (TW)]]
[[Category:Chihy-Yuan Cheng of Hsinchu (TW)]]
[[Category:Sz-Fan Chien of Hsinchu (TW)]]
[[Category:Chien-Hung Lin of Hsinchu (TW)]]
[[Category:Chun-Chang Chen of Hsinchu (TW)]]
[[Category:Ching-Sen Kuo of Hsinchu (TW)]]
[[Category:Feng-Jia Shiu of Hsinchu (TW)]]
METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18225576 titled 'METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS
Simplified Explanation
The patent application describes a method for reducing electrostatic charges in a semiconductor substrate. Here are the key points:
- The method involves applying a layer of photoresist on the semiconductor substrate.
- The photoresist layer is exposed to radiation, which helps in the subsequent development process.
- A developer solution is used to develop the photoresist layer, removing unwanted portions.
- The semiconductor substrate is then cleaned with a first cleaning liquid to remove the developer solution.
- To further minimize electrostatic charges, a solution called tetramethylammonium hydroxide (TMAH) is applied to the semiconductor substrate.
- The TMAH solution helps in reducing the accumulation of charges in the semiconductor substrate, improving its overall performance.
Original Abstract Submitted
Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.