US Patent Application 18448095. METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING simplified abstract

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METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Sui-Ying Hsu of Hsinchu (TW)

Yuehying Lee of Hsinchu (TW)

Chien-Ying Wu of Hsinchu (TW)

Chen-Hao Huang of Hsinchu (TW)

Chien-Chang Lee of Hsinchu (TW)

Chia-Ping Lai of Hsinchu (TW)

METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18448095 titled 'METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING

Simplified Explanation

- The patent application describes a method of using a coupling system for optical fibers and chips. - The method involves aligning an optical fiber with a cavity in a chip, with the fiber oriented at an angle between 88 and 92 degrees with respect to the chip's top surface. - An optical signal is emitted from the optical fiber. - The optical signal is redirected into a waveguide using a grating positioned on the opposite side of the cavity from the optical fiber.


Original Abstract Submitted

A method of using a coupling system includes aligning an optical fiber with a cavity in a chip, wherein aligning the optical fiber comprises orienting the fiber within an angle ranging from about 88-degrees to about 92-degrees with respect to a top surface of the chip. The method further includes emitting an optical signal from the optical fiber. The method further includes redirecting the optical signal into a waveguide using a grating positioned on an opposite side of the cavity from the optical fiber.