US Patent Application 17898163. POLISHING METROLOGY simplified abstract
Contents
POLISHING METROLOGY
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih Hung Chen of Hsinchu City (TW)
Kei-Wei Chen of Tainan City (TW)
Syun-Ming Jang of Hsin-Chu (TW)
POLISHING METROLOGY - A simplified explanation of the abstract
This abstract first appeared for US patent application 17898163 titled 'POLISHING METROLOGY
Simplified Explanation
The patent application describes methods and systems for chemical mechanical polishing (CMP).
- CMP process involves contacting a polishing pad and a substrate at an interface.
- During the CMP process, a force on the polishing pad at the interface is measured to obtain force measurement values.
- The force measurement values are used to determine when the CMP process is complete.
Original Abstract Submitted
Methods and system for chemical mechanical polishing (CMP) are provided. A method may include performing a CMP process by contacting a polishing pad and a substrate at an interface. During the CMP process, the method includes measuring a force on the polishing pad at the interface to obtain force measurement values. Also, the method includes determining when the CMP process is complete based on the force measurement values.
Category:B24B37/013 Category:H01L21/306 Category:H01L21/66
