US Patent Application 17827992. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==
[[Category:Wei-Ming Wang of Taichung City (TW)]]
[[Category:Yu-Hung Lin of Taichung City (TW)]]
[[Category:Shih-Peng Tai of Hsinchu County (TW)]]
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17827992 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
- The patent application describes a semiconductor package and a method for manufacturing it. - The semiconductor package includes a substrate, a semiconductor die, a semiconductor frame structure, a semiconductor cover structure, and conductive balls. - The substrate has a ground plate embedded in it. - The semiconductor die is placed on the substrate and connected to it electrically. - The semiconductor frame structure surrounds the semiconductor die and is also placed on the substrate. - The semiconductor frame structure includes conductive through semiconductor vias (TSVs) that penetrate through it, and at least one of these TSVs is connected to the ground plate. - The semiconductor cover structure is placed on top of the semiconductor frame structure and the semiconductor die. - The semiconductor cover structure includes a conductive grid pattern that makes contact with the conductive TSVs. - The conductive balls are placed on the substrate and connected to the semiconductor die through the substrate.
Original Abstract Submitted
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor die, a semiconductor frame structure, a semiconductor cover structure and conductive balls. The substrate has a ground plate embedded therein. The semiconductor die is disposed on the substrate and electrically connected with the substrate. The semiconductor frame structure is disposed on the substrate and surrounds the semiconductor die. The semiconductor frame structure includes conductive through semiconductor vias (TSVs) penetrating through the semiconductor frame structure, and at least one conductive TSV is electrically connected with the ground plate. The semiconductor cover structure is disposed on the semiconductor frame structure and on the semiconductor die. The semiconductor cover structure includes a conductive grid pattern and the conductive grid pattern contacts the conductive TSVs. The conductive balls are disposed on the substrate and electrically connected with the semiconductor die through the substrate.
