US Patent Application 18232758. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Chun-Wei Liao of Taoyuan (TW)]]

[[Category:Tung-Hung Feng of Hsinchu (TW)]]

[[Category:Hui-Chun Lee of Hsinchu (TW)]]

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18232758 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Simplified Explanation

The abstract describes a system for manufacturing a semiconductor device that includes an edge coating device. This device consists of several components such as a first stage, a first shielding disk, one or more first openings, one or more second openings, and a resist dispensing module.

• The system is designed for manufacturing semiconductor devices.
• The edge coating device is a crucial component of the system.
• The device includes a first stage, which likely serves as a base or platform for other components.
• A first shielding disk is present, which may provide protection or containment for the coating process.
• The device has one or more first openings, which could be used for input or output of materials.
• It also has one or more second openings, which may serve a different purpose than the first openings.
• A resist dispensing module is included, suggesting the device is used for applying resist materials.
• The purpose of the edge coating device is not explicitly mentioned, but it likely plays a role in the manufacturing process of semiconductor devices.

Original Abstract Submitted

A system for manufacturing a semiconductor device comprises an edge coating device. The edge coating device comprises a first stage, a first shielding disk, one or more first openings, one or more second openings, and a resist dispensing module.