US Patent Application 17828648. METHOD FOR CHIP INTEGRATION simplified abstract

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METHOD FOR CHIP INTEGRATION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Yung Feng Chang of Hsinchu (TW)

Yu-Jung Chang of Hsinchu County (TW)

Tung-Heng Hsieh of Hsinchu County (TW)

Bao-Ru Young of Hsinchu County (TW)

METHOD FOR CHIP INTEGRATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17828648 titled 'METHOD FOR CHIP INTEGRATION

Simplified Explanation

The patent application describes a method for making an integrated circuit (IC) using black boxes and circuit macros. Here are the key points:

  • The method involves inserting black boxes into the IC layout and connecting them with a connectivity network.
  • First dummy patterns are inserted in areas outside of the black boxes and connectivity network.
  • The black boxes are then replaced with circuit macros that have a one-to-one correspondence with the black boxes.
  • Each circuit macro includes circuit patterns in a central area and second dummy patterns surrounding it.
  • The method utilizes electronic design automation (EDA) tools to perform various operations such as inserting black boxes, connecting them, inserting dummy patterns, and replacing black boxes with circuit macros.


Original Abstract Submitted

A method for making an integrated circuit (IC) includes inserting black boxes into a layout of the IC; connecting the black boxes with a connectivity network; and inserting first dummy patterns in areas of the layout outside of the black boxes and the connectivity network. After the inserting of the first dummy patterns, the method further includes replacing the black boxes with circuit macros that have one-to-one correspondence with the black boxes, wherein each of the circuit macros includes circuit patterns in a central area of the respective circuit macro and second dummy patterns surrounding the central area. In the method, at least one of the following operations is performed by an electronic design automation (EDA) tool: the inserting of the black boxes, the connecting of the black boxes, the inserting of the first dummy patterns, and the replacing of the black boxes with the circuit macros.