US Patent Application 18447549. LOCAL INTERCONNECT simplified abstract

LOCAL INTERCONNECT

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Cheng-Hsien Wu of Hsinchu (TW)]]

[[Category:Chung-Yi Lin of Hsinchu County (TW)]]

[[Category:Yen-Sen Wang of Hsinchu City (TW)]]

LOCAL INTERCONNECT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18447549 titled 'LOCAL INTERCONNECT

Simplified Explanation

The patent application describes semiconductor structures and methods.

• The semiconductor structure includes three metal lines.
• The first metal line extends in one direction.
• The second metal line is aligned with and spaced apart from the first metal line.
• The third metal line also extends in the same direction as the first metal line.
• The third metal line has a branch that extends in a perpendicular direction between the first and second metal lines.

Original Abstract Submitted

Semiconductor structures and methods are provided. A semiconductor structure according to the present disclosure includes a first metal line extending along a first direction, a second metal line lengthwise aligned with and spaced apart from the first metal line, and a third metal line extending along the first direction. The third metal line includes a branch extending along a second direction perpendicular to the first direction and the branch partially extends between the first metal line and the second metal line.