US Patent Application 17826174. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==
[[Category:Wang-Chun Huang of Kaohsiung City (TW)]]
[[Category:Hou-Yu Chen of Hsinchu County (TW)]]
[[Category:Jin Cai of Hsinchu City (TW)]]
[[Category:Chih-Hao Wang of Hsinchu County (TW)]]
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17826174 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a semiconductor device that includes vertically stacked semiconductor nanosheets, a gate structure, and a dielectric spacer.
- The semiconductor nanosheets are arranged above a semiconductor substrate and act as channel regions.
- The bottommost semiconductor nanosheet is the thinnest among the stacked nanosheets and is closest to the semiconductor substrate.
- The gate structure surrounds each of the semiconductor nanosheets in a specific cross-section.
- The dielectric spacer is positioned between the bottommost semiconductor nanosheet and the semiconductor substrate and is connected to the gate structure in the same cross-section.
Original Abstract Submitted
A semiconductor device includes semiconductor nanosheets, a gate structure, and a dielectric spacer. The semiconductor nanosheets are vertically stacked over each other, disposed above a semiconductor substrate, and serve as channel regions. A bottommost semiconductor nanosheet most proximate from the semiconductor substrate is a thinnest nanosheet of the semiconductor nanosheets. The gate structure surrounds each of the semiconductor nanosheets in a first cross-section, and the dielectric spacer is interposed between the bottommost semiconductor nanosheet and the semiconductor substrate and adjoins the gate structure in the first cross-section.