US Patent Application 17824353. SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION simplified abstract

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SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Shu-Chun Yang of Changhua County (TW)]]

[[Category:Wei Chih Chen of Hsinchu City (TW)]]

SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17824353 titled 'SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION

Simplified Explanation

The patent application describes a semiconductor package that includes a routing structure, two dies, and arrays of contact features.

  • The semiconductor package includes a routing structure, which is responsible for connecting the dies and the contact features.
  • There are two dies in the package, referred to as the first die and the second die.
  • The first die and the second die are placed over the routing structure.
  • The first die is electrically connected to the routing structure through a first array of contact features.
  • The second die is electrically connected to the routing structure through a second array of contact features.
  • The routing structure consists of multiple metal lines that connect the contact features of the first and second dies.
  • Each metal line in the routing structure has at least two 90-degree turns on a horizontal plane.


Original Abstract Submitted

A semiconductor package according to the present disclosure includes a routing structure, a first die and a second die disposed over the routing structure, a first array of contact features disposed along a first direction and electrically coupling the first die to the routing structure, and a second array of contact features disposed along the first direction and electrically coupling the second die to the routing structure. The routing structure includes a plurality of metal lines and each of the plurality of metal lines electrically connects one of the first array of contact features and one of the second array of contact features. Each of the plurality of metal lines comprises at least two 90-degree turns on a horizontal plane.

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