US Patent Application 17825336. VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS simplified abstract

VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Ting-Yu Yeh of Hsinchu (TW)]]

[[Category:Shu-Cheng Li of Hsinchu (TW)]]

[[Category:Chun-Hsien Wen of Taoyuan County (TW)]]

[[Category:Chih-Wei Chang of Hsinchu (TW)]]

VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17825336 titled 'VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS

Simplified Explanation

The patent application describes connection structures and manufacturing methods for electronic devices.

• Conductive structures are placed between and in contact with multiple via structures.
• The via structures are positioned in a way that avoids stacking them on top of each other.
• Each via is connected to at least two other vias on the same level of the semiconductor device.
• This connection is achieved through conductive traces and footprints of the connection structure.

Original Abstract Submitted

Connection structures and methods of manufacture in which a conductive structure is disposed between, and in electrical contact with, pluralities of via structures. Each via structure is laterally offset from adjacent via structures to avoid stacked vias, and each via is electrically connected to at least two additional vias on a level of a semiconductor device, through conductive traces and footprints of the connection structure.