US Patent Application 18358790. METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING simplified abstract
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chung-Ming Weng of Hsinchu (TW)
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18358790 titled 'METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING
Simplified Explanation
- The patent application describes a method of making a semiconductor device. - The method involves creating an opening in a substrate that extends from one side to the other. - A dielectric material with a specific refractive index is deposited into the opening. - The dielectric material is then etched to create a core opening within it. - A core material with a different refractive index is deposited into the core opening. - The core material is optically transparent. - Excess core material is removed from the substrate's surface.
Original Abstract Submitted
A method of making a semiconductor device includes defining an opening extending from a first side of a substrate to a second side of the substrate, wherein the first side of the substrate is opposite the second side of the substrate. The method further includes depositing a dielectric material into the opening, wherein the dielectric material has a first refractive index. The method further includes etching the dielectric material to define a core opening extending from the first side of the substrate to the second side of the substrate. The method further includes depositing a core material into the core opening, wherein the core material has a second refractive index different from the first refractive index, and the core material is optically transparent. The method further includes removing excess core material from a surface of the substrate.
