US Patent Application 18358790. METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING simplified abstract

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METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Yu-Hao Chen of Hsinchu (TW)

Chung-Ming Weng of Hsinchu (TW)

Tsung-Yuan Yu of Hsinchu (TW)

Hui Yu Lee of Hsinchu (TW)

Hung-Yi Kuo of Hsinchu (TW)

Jui-Feng Kuan of Hsinchu (TW)

Chien-Te Wu of Hsinchu (TW)

METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18358790 titled 'METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING

Simplified Explanation

- The patent application describes a method of making a semiconductor device. - The method involves creating an opening in a substrate that extends from one side to the other. - A dielectric material with a specific refractive index is deposited into the opening. - The dielectric material is then etched to create a core opening within it. - A core material with a different refractive index is deposited into the core opening. - The core material is optically transparent. - Excess core material is removed from the substrate's surface.


Original Abstract Submitted

A method of making a semiconductor device includes defining an opening extending from a first side of a substrate to a second side of the substrate, wherein the first side of the substrate is opposite the second side of the substrate. The method further includes depositing a dielectric material into the opening, wherein the dielectric material has a first refractive index. The method further includes etching the dielectric material to define a core opening extending from the first side of the substrate to the second side of the substrate. The method further includes depositing a core material into the core opening, wherein the core material has a second refractive index different from the first refractive index, and the core material is optically transparent. The method further includes removing excess core material from a surface of the substrate.