US Patent Application 18447543. SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL simplified abstract
Contents
SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chin-Szu Lee of Taoyuan City (TW)
Hua-Sheng Chiu of Zhudong Town (TW)
SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18447543 titled 'SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL
Simplified Explanation
- The patent application describes a shutter disc used during a conditioning process in a deposition tool's processing chamber. - The shutter disc is made of a material with a wave-shaped section, which helps reduce heat transfer and relieve thermal stresses. - The backside of the shutter disc has a thin-film material deposition, and the diameter of the disc creates a spacing between the inner edge of the thin-film material and the outer edge of a substrate support component. - This spacing prevents material accumulation, reduces tilting caused by placement errors, and minimizes heat transfer to the shutter disc.
Original Abstract Submitted
Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.
