US Patent Application 18446740. WIRE-BOND DAMPER FOR SHOCK ABSORPTION simplified abstract
Contents
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Tsung-Lin Hsieh of Hsinchu City (TW)
Wei-Jhih Mao of Taipei City (TW)
Shang-Ying Tsai of Pingzhen City (TW)
Kuei-Sung Chang of Kaohsiung City (TW)
Chun-Wen Cheng of Zhubei City (TW)
WIRE-BOND DAMPER FOR SHOCK ABSORPTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446740 titled 'WIRE-BOND DAMPER FOR SHOCK ABSORPTION
Simplified Explanation
The patent application is for a microelectromechanical systems (MEMS) package that includes a wire-bond damper.
- The MEMS package consists of a housing structure, a support substrate, and a MEMS structure.
- The MEMS structure includes an anchor, a spring, and a movable mass.
- The spring connects the anchor to the movable mass, allowing for movement of the mass within a cavity.
- The wire-bond damper is located on the movable mass or the structure surrounding it.
- The wire-bond damper can be on the top surface of the movable mass or on the support substrate between the anchor and the movable mass.
- The wire-bond damper is made of a wire formed by wire bonding and is designed to dampen shock to the movable mass.
Original Abstract Submitted
Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.
Category:B81B7/00 Category:B81C1/00