US Patent Application 18362037. SEMICONDUCTOR WAFER COOLING simplified abstract
Contents
SEMICONDUCTOR WAFER COOLING
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yung-Yao Lee of Zhubei City (TW)
Cheng-Kang Hu of Kaohsiung City (TW)
Jui-Chun Peng of Hsinchu City (TW)
Hsu-Shui Liu of Pingjhen City (TW)
SEMICONDUCTOR WAFER COOLING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18362037 titled 'SEMICONDUCTOR WAFER COOLING
Simplified Explanation
- The patent application is for a cooling controller that receives information about a wafer from sensors. - The cooling controller determines the area of the pattern mask on the wafer based on this information. - Based on the pattern mask area, the cooling controller determines the cooling time required for the wafer. - The cooling controller then uses a cooling plate to cool the wafer for the determined cooling time. - This method ensures stable and consistent temperatures for wafers with different mask and layout properties. - The result is a reduction in mask overlay variation and an increase in wafer yield.
Original Abstract Submitted
A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.
