US Patent Application 18363742. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Meng-Liang Lin of Hsinchu (TW)]]

[[Category:Po-Yao Chuang of Hsin-Chu (TW)]]

[[Category:Te-Chi Wong of Hsinchu (TW)]]

[[Category:Shuo-Mao Chen of New Taipei City (TW)]]

[[Category:Shin-Puu Jeng of Hsinchu (TW)]]

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18363742 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a semiconductor package and a method for manufacturing it.

• The semiconductor package consists of a circuit substrate, a semiconductor die, and a filling material.
• The circuit substrate has a cavity concave from one surface and includes a dielectric material and a metal floor plate embedded in it.
• The metal floor plate is electrically floating and isolated by the dielectric material.
• The semiconductor die is placed in the cavity and connected to the circuit substrate.
• The filling material fills the cavity and encapsulates the semiconductor die, attaching it to the circuit substrate.

Original Abstract Submitted

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. The circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. The circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. A location of the metal floor plate corresponds to a location of the cavity. The metal floor plate is electrically floating and isolated by the dielectric material. The semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. The filling material is disposed between the semiconductor die and the circuit substrate. The filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.