US Patent Application 18447161. DEVICE FOR FORMING CONDUCTIVE POWDER simplified abstract

DEVICE FOR FORMING CONDUCTIVE POWDER

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

You-Hua Chou of Hsinchu City (TW)

Kuo-Sheng Chuang of Hsinchu City (TW)

DEVICE FOR FORMING CONDUCTIVE POWDER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18447161 titled 'DEVICE FOR FORMING CONDUCTIVE POWDER

Simplified Explanation

- The patent application describes a device that can produce conductive powder. - The device has a reaction chamber where a conductive powder precursor gas, an inert gas, and a hydrogen gas are introduced. - A radio frequency power unit is used to create a plasma by combining the inert gas and hydrogen gas. - The plasma is then used to reduce the conductive powder precursor gas through a reduction reaction, resulting in the formation of conductive powder. - The device also includes powder collecting cells that separate the conductive powder based on particle size. - A solvent inlet is provided to disperse the conductive powder in a solvent within the powder collecting cells.

Original Abstract Submitted

A device for forming a conductive powder includes a reaction chamber configured to receive a conductive powder precursor gas, an inert gas and a hydrogen gas. The device further includes a radio frequency (RF) power unit configured to ignite a plasma using the inert gas and the hydrogen gas, wherein the plasma is usable to reduce, by a reduction reaction, the conductive powder precursor gas to form the conductive powder. The device further includes powder collecting cells configured to separate the conductive powder based on particle size. The device further includes a solvent inlet configured to provide a solvent to the powder collecting cells for dispersing the conductive powder in a solvent.

Category:B22F9/28 Category:H01L21/768 Category:H01L21/288 Category:C23C16/02 Category:C23C16/26