US Patent Application 18361249. SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
Contents
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==
[[Category:Meng-Han Lin of Hsinchu (TW)]]
[[Category:Chia-En Huang of Xinfeng Township (TW)]]
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18361249 titled 'SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
Simplified Explanation
The patent application describes a semiconductor die that includes two semiconductor devices.
- The first semiconductor device consists of a sub-array of memory devices and an interface portion with a staircase profile in a vertical direction.
- The second semiconductor device is located adjacent to the first device in the opposite direction and also includes a sub-array of memory devices and an interface portion with a staircase profile.
- The first and second semiconductor devices are electrically isolated from each other.
Original Abstract Submitted
A semiconductor die comprises: a first semiconductor device and a second semiconductor device. The first semiconductor device comprises a first device portion comprising a first sub-array of memory devices, and a first interface portion located adjacent to the first device portion in a first direction. The first interface portion has a staircase profile in a vertical direction. The second semiconductor device comprises a second device portion adjacent to the first device portion in the first direction opposite the first interface portion. The second device portion comprises a second sub-array of memory devices, and a second interface portion located adjacent to the first device portion in the first direction opposite the first interface portion. The second interface portion also has a staircase profile in the vertical direction. The first semiconductor device is electrically isolated from the second semiconductor device.