Category:H01L25/18

H01L 25/18 - Overview

H01L 25/18 is a subsection of the International Patent Classification system, specifically within the category of H01L, which pertains to semiconductor devices; electric solid state devices not otherwise provided for. This particular code focuses on:

Semiconductor Devices

Aspects related to semiconductor devices which are structurally and functionally integrated.

Electric Solid State Devices

This involves devices that leverage the electrical properties of solid materials to control the flow of current.

Multi-chip Modules (MCM)

H01L 25/18 specifically addresses multi-chip modules (MCM). These are electronic components where multiple integrated circuits (ICs), semiconductor dies, or other discrete components are packaged onto a unifying substrate, enhancing performance and reducing size.

Key Innovations and Companies in H01L 25/18

Several companies have made significant contributions in the field covered by H01L 25/18:

Intel Corporation

Intel has been a leader in developing advanced multi-chip modules, integrating various functions like CPU, GPU, and memory in compact forms. Their innovations often involve high-speed interconnects and efficient heat dissipation technologies.

Samsung Electronics

Samsung's advancements in multi-chip module technology are notable, particularly in the integration of memory and logic components, which is crucial for mobile devices and high-performance computing systems.

Lesser-Known Innovators

Smaller companies like XYZ Semiconductors (fictional example) also contribute significantly to this field, often focusing on specialized applications or novel integration techniques.

IPC Classifications and Categories

The innovations in H01L 25/18 fall into several categories under the IPC system. These include:

• H01L29 - Semiconductor devices based on specific semiconductors
• H01L31 - Solid state devices using organic materials

See Also

• Semiconductor device fabrication
• Integrated circuit packaging