18520958. Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 Semiconductor Device and Method of Manufacture
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this method compare to traditional semiconductor packaging techniques?
- 1.11 What are the specific materials used in the encapsulation process?
- 1.12 Original Abstract Submitted
Semiconductor Device and Method of Manufacture
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chien-Hsun Lee of Chu-tung Town (TW)
Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 18520958 titled 'Semiconductor Device and Method of Manufacture
Simplified Explanation
The method described in the abstract involves encapsulating a tested semi-finished substrate in an encapsulant, placing a semiconductor die on the substrate, electrically coupling the die to the substrate, encasing the die in a second encapsulant, removing the carrier substrate, and bonding external contacts to the substrate.
- Tested semi-finished substrate arranged on a carrier substrate
- Semiconductor die placed on the substrate
- Die electrically coupled to the substrate
- Encapsulation of the die and substrate
- Removal of the carrier substrate
- Bonding of external contacts to the substrate
Potential Applications
The technology described in this patent application could be applied in the manufacturing of various semiconductor devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
This method helps in ensuring the reliability and performance of semiconductor devices by using tested and known good substrates, improving the overall quality of the final product.
Benefits
The use of tested substrates reduces the risk of defects and failures in semiconductor devices, leading to higher yields and lower production costs. Additionally, the encapsulation process helps in protecting the semiconductor components from external factors, increasing their durability.
Potential Commercial Applications
The technology outlined in this patent application could find applications in industries such as electronics, telecommunications, automotive, and aerospace, where high-performance and reliable semiconductor devices are essential.
Possible Prior Art
One possible prior art for this technology could be the use of similar encapsulation methods in the semiconductor industry to protect and enhance the performance of electronic components.
Unanswered Questions
How does this method compare to traditional semiconductor packaging techniques?
The article does not provide a comparison between this method and traditional semiconductor packaging techniques in terms of cost, efficiency, and performance.
What are the specific materials used in the encapsulation process?
The article does not detail the specific materials used in the encapsulation process and their properties, which could be crucial for understanding the effectiveness of the method.
Original Abstract Submitted
A method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. Encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. Electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. Removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.
