17826521. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Unbyoung Kang of Hwaseong-si (KR)
Byeongchan Kim of Asan-si (KR)
Jumyong Park of Cheonan-si (KR)
Hyunsu Hwang of Siheung-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17826521 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes two semiconductor chips stacked on top of each other and connected through bonding pads and insulation material.
- The package includes two semiconductor chips with active surfaces and inactive surfaces.
- The chips are stacked on top of each other, with the second chip's active surface facing the first chip's inactive surface.
- A bonding insulation material layer is placed between the two chips.
- Bonding pads are surrounded by the insulation material layer to establish electrical connections between the two chips.
Potential Applications
- This technology can be used in various electronic devices that require compact and efficient semiconductor packaging.
- It can be applied in mobile devices, computers, and other consumer electronics.
Problems Solved
- The semiconductor package solves the problem of limited space in electronic devices by stacking multiple chips on top of each other.
- It provides a reliable and efficient method of connecting the chips through bonding pads and insulation material.
Benefits
- The semiconductor package allows for higher integration of chips in electronic devices, leading to improved performance and functionality.
- It enables smaller and more compact electronic devices without sacrificing performance.
- The bonding pads and insulation material ensure secure and reliable electrical connections between the chips.
Original Abstract Submitted
A semiconductor package includes: a first semiconductor chip including a first semiconductor substrate including a first active surface and a first inactive surface opposite to each other and a plurality of first chip pads on the first active surface; a second semiconductor chip including a second semiconductor substrate including a second active surface and a second inactive surface opposite to each other and a plurality of second chip pads on the second active surface, the second active surface being stacked on the first semiconductor chip to face the first inactive surface; a bonding insulation material layer interposed between the first semiconductor chip and the second semiconductor chip; and a plurality of bonding pads surrounded by the bonding insulation material layer to electrically connect the first semiconductor chip to the second semiconductor chip.
