17703700. METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chung-Hao Tsai of Huatan Township (TW)

Tzu-Chun Tang of Kaohsiung (TW)

Chuei-Tang Wang of Taichung (TW)

METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17703700 titled 'METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION

Simplified Explanation

The abstract of this patent application describes embodiments that provide regulated power routing through various inactive features of a device. These inactive features can include a through via wall, heat dissipation features, and dummy via blocks. The embodiments can also combine these features without limitation.

  • Regulated power routing through inactive features of a device
  • Inactive features can include through via walls, heat dissipation features, and dummy via blocks
  • Embodiments can combine these features without limitation

Potential Applications

This technology can be applied in various electronic devices and systems, including but not limited to:

  • Mobile devices
  • Computers and laptops
  • Internet of Things (IoT) devices
  • Wearable devices
  • Automotive electronics

Problems Solved

The technology addresses the following problems:

  • Efficient power routing in electronic devices
  • Effective heat dissipation in high-performance systems
  • Optimizing space utilization in device design
  • Enhancing overall device performance and reliability

Benefits

The benefits of this technology include:

  • Improved power regulation and distribution
  • Enhanced heat dissipation and thermal management
  • Space-saving design options
  • Increased device performance and reliability


Original Abstract Submitted

Embodiments provide regulated power routing through various inactive features of a device. In one embodiment, such inactive features include a through via wall which can be formed in an encapsulating material of a die stack. In another embodiment, such inactive features include a heat dissipation features formed over the die stack. In another embodiment, such inactive features include dummy via blocks attached adjacent a die cube. Yet other embodiments may combine the features of these embodiments without limitation.

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