17874404. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17874404 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes a package substrate, a semiconductor device, a package cap, and an adhesive layer. The package cap has a trench with a trapezoidal cross-section, and the adhesive layer fills the trench.
- The semiconductor package includes a package substrate with a mount region and a peripheral region.
- A semiconductor device is mounted on the mount region of the package substrate.
- A package cap is placed on the peripheral region of the package substrate.
- The package cap has a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device.
- The bottom surface of the package cap has a trench with a trapezoidal cross-section.
- The width of the trench decreases in a direction away from the bottom surface of the package cap.
- An adhesive layer is present between the package substrate and the bottom surface of the package cap.
- The adhesive layer is in contact with the top surface of the package substrate and the bottom surface of the package cap.
- The adhesive layer fills the trench.
Potential Applications
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
- Provides improved adhesion between the package substrate and the package cap
- Enhances the structural integrity of the semiconductor package
Benefits
- Stronger bond between the package substrate and the package cap
- Increased reliability and durability of the semiconductor package
- Improved protection for the semiconductor device
Original Abstract Submitted
Disclosed is a semiconductor package comprising a package substrate having a mount region and a peripheral region that surrounds the mount region, a semiconductor device on the mount region of the package substrate, a package cap on the peripheral region of the package substrate and including a partition portion that surrounds the semiconductor device and an extension portion that covers the semiconductor device, and an adhesive layer between the package substrate and a bottom surface of the package cap. The bottom surface of the package cap has a trench. The trench has a trapezoidal cross-section whose width decreases in a direction receding from the bottom surface of the package cap. The adhesive layer is in contact with a top surface of the package substrate and the bottom surface of the package cap. The adhesive layer fills the trench.
