17823634. SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION STRUCTURE
Organization Name
Inventor(s)
Jiyeong Kim of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17823634 titled 'SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION STRUCTURE
Simplified Explanation
The abstract describes a semiconductor package that includes a redistribution structure with multiple redistribution insulation layers and redistribution line patterns. It also includes redistribution vias that connect to the redistribution line patterns. At least one semiconductor chip is placed on the redistribution structure and connected to the redistribution line patterns and vias.
- The semiconductor package includes a redistribution structure with stacked redistribution insulation layers.
- The redistribution structure has redistribution line patterns on its upper and lower surfaces, forming distribution layers at different vertical levels.
- The package also includes redistribution vias that penetrate the redistribution insulation layers and connect to some of the redistribution line patterns.
- At least one semiconductor chip is placed on the redistribution structure and connected to the redistribution line patterns and vias.
Potential Applications
- This technology can be used in various electronic devices that require semiconductor packages, such as smartphones, tablets, and computers.
- It can be applied in automotive electronics, medical devices, and industrial equipment that rely on semiconductor components.
Problems Solved
- The redistribution structure with multiple redistribution insulation layers allows for more efficient routing of electrical connections within the semiconductor package.
- The redistribution vias provide additional connection points for the redistribution line patterns, enhancing the overall connectivity of the package.
- The stacked redistribution insulation layers and redistribution line patterns enable a compact design, saving space in electronic devices.
Benefits
- The semiconductor package offers improved electrical connectivity and signal transmission due to the redistribution vias and redistribution line patterns.
- The compact design of the package allows for smaller and thinner electronic devices.
- The technology provides a more efficient and reliable solution for integrating semiconductor chips into electronic devices.
Original Abstract Submitted
A semiconductor package includes: a redistribution structure including a plurality of redistribution insulation layers, which are stacked, a plurality of redistribution line patterns on an upper surface and a lower surface of the plurality of redistribution insulation layers, and constituting a plurality of distribution layers at different vertical levels from each other, and a plurality of redistribution vias that penetrate at least one redistribution insulation layer of the plurality of redistribution insulation layers and are connected to some of the plurality of redistribution line patterns; and at least one semiconductor chip on the redistribution structure and electrically connected to the plurality of redistribution line patterns and the plurality of redistribution vias.
