18322774. SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Jaeseon Hwang of Suwon-si (KR)
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18322774 titled 'SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a soldering device and method that utilize a control unit to predict the final rise temperature of an electronic device during soldering, based on various parameters such as power of a light pulse, weight of the electronic device, real-time temperature, quantity of exposures of the light pulse, and irradiation period. The condition of the light pulse is then adjusted based on the predicted result.
- Control unit predicts final rise temperature of electronic device during soldering
- Parameters considered include power of light pulse, weight of device, real-time temperature, quantity of exposures, and irradiation period
- Condition of light pulse is adjusted based on predicted result
Potential Applications
This technology could be applied in various industries where precise soldering of electronic components is required, such as electronics manufacturing, automotive assembly, and medical device production.
Problems Solved
1. Ensures accurate prediction of final rise temperature during soldering process 2. Helps prevent overheating or damage to electronic devices
Benefits
1. Improved soldering accuracy and efficiency 2. Enhanced safety for electronic components 3. Cost-effective solution for soldering processes
Potential Commercial Applications
Optimizing Soldering Process for Electronic Components: Improving Efficiency and Accuracy
Possible Prior Art
There may be prior art related to soldering devices and methods that aim to predict and control the temperature rise of electronic devices during soldering processes. Research in the field of soldering technology and electronic manufacturing may reveal relevant prior art.
Unanswered Questions
How does this technology compare to traditional soldering methods?
This article does not provide a direct comparison between this innovative soldering method and traditional soldering techniques. It would be beneficial to understand the specific advantages and limitations of this new approach in comparison to conventional methods.
What are the potential limitations or challenges of implementing this technology in different soldering applications?
The article does not address the potential obstacles or constraints that may arise when implementing this technology in various soldering applications. It would be important to explore any limitations or challenges that could affect the widespread adoption of this innovative soldering device and method.
Original Abstract Submitted
A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result. A soldering method includes calculating power of the light pulse based on a time width of the light pulse, measuring a temperature of the electronic device, and predicting a final rise temperature of the electronic device, based on the calculated power, a weight of the electronic device, the measured temperature, the quantity of exposures of the light pulse, and the irradiation period.
