18349017. NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jae Ho Ahn of Seoul (KR)

Ji Won Kim of Seoul (KR)

Sung-Min Hwang of Hwaseong-si (KR)

Joon-Sung Lim of Seongnam-si (KR)

Suk Kang Sung of Seongnam-si (KR)

NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18349017 titled 'NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The abstract describes a nonvolatile memory device that includes various components such as a substrate, ground selection line, word lines, landing pad, rear contact plug, front contact plug, input/output pad, and upper bonding pad. These components are interconnected to form a memory device.

  • The substrate is the base material on which the memory device is built.
  • The ground selection line is a conductive line that extends in a specific direction on the substrate.
  • The word lines are multiple conductive lines stacked sequentially on the ground selection line and also extend in the same direction.
  • The landing pad is a structure that is spaced apart from the ground selection line and word lines.
  • The rear contact plug is connected to the lower face of the landing pad and extends in a direction perpendicular to the ground selection line and word lines.
  • The front contact plug is connected to the upper face of the landing pad, opposite to the rear contact plug, and also extends in the same perpendicular direction.
  • The input/output pad is electrically connected to the rear contact plug.
  • The upper bonding pad is electrically connected to the front contact plug and is connected to multiple circuit elements of the nonvolatile memory device.

Potential applications of this technology:

  • Nonvolatile memory devices are commonly used in various electronic devices such as computers, smartphones, and tablets. This technology can be applied in these devices to provide reliable and efficient memory storage.
  • The memory device can be used in data storage systems, allowing for fast and secure data storage and retrieval.

Problems solved by this technology:

  • Nonvolatile memory devices are essential for storing data even when power is turned off. This technology provides a reliable and efficient solution for nonvolatile memory storage.
  • The interconnection of various components in the memory device ensures proper functioning and data integrity.

Benefits of this technology:

  • The memory device offers a compact and efficient design, allowing for high-density memory storage.
  • The interconnection of components ensures reliable data storage and retrieval.
  • The technology provides a cost-effective solution for nonvolatile memory devices.


Original Abstract Submitted

A nonvolatile memory device including a substrate extending in a first direction, a ground selection line extending in the first direction on the substrate, a plurality of word lines stacked sequentially on the ground selection line and extending in the first direction, a landing pad spaced apart from the ground selection line and the plurality of word lines in the first direction, a rear contact plug connected to a lower face of the landing pad and extending in a second direction intersecting the first direction, a front contact plug connected to an upper face of the landing pad opposite the lower face and extending in the second direction, an input/output pad electrically connected to the rear contact plug, and an upper bonding pad electrically connected to the front contact plug and connected to at least a part of a plurality of circuit elements of the nonvolatile memory device.