Samsung electronics co., ltd. (20240105662). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105662 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a first connection structure with a first redistribution layer, a first semiconductor chip with a first connection pad, a second semiconductor chip with a second connection pad, an interconnection bridge, and a second connection structure with a second redistribution layer.
- The first connection structure includes a first redistribution layer.
- The first semiconductor chip is connected to the first redistribution layer.
- The second semiconductor chip is connected to the first redistribution layer.
- The interconnection bridge connects the first and second connection pads.
- The second connection structure embeds the interconnection bridge and includes a second redistribution layer.
Potential Applications
The technology described in the patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology solves the problem of efficiently connecting multiple semiconductor chips within a compact package, allowing for increased functionality and performance in electronic devices.
Benefits
The benefits of this technology include improved electrical connections, reduced package size, increased functionality, and enhanced performance of electronic devices.
Potential Commercial Applications
The semiconductor package technology could be applied in the semiconductor industry for manufacturing advanced electronic devices with multiple chips in a compact package, catering to the growing demand for high-performance and multifunctional devices.
Possible Prior Art
One possible prior art for this technology could be the use of stacked semiconductor chips in a package, but the specific configuration and interconnection methods described in this patent application may be novel and inventive.
Unanswered Questions
How does this technology compare to traditional packaging methods for semiconductor chips?
This technology offers a more compact and efficient way to connect multiple semiconductor chips within a package, potentially reducing the overall size and improving performance.
What are the potential challenges in implementing this technology on a large scale in semiconductor manufacturing?
One potential challenge could be ensuring the reliability and durability of the interconnection bridges and redistribution layers over time and under various operating conditions.
Original Abstract Submitted
a semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.
