17849300. SEMICONDUCTOR PACKAGING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGING
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Tien-Chung Yang of Hsinchu (TW)
Li-Hsien Huang of Hsinchu (TW)
Yao-Chun Chuang of Hsinchu (TW)
SEMICONDUCTOR PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 17849300 titled 'SEMICONDUCTOR PACKAGING
Simplified Explanation
The present disclosure describes a structure and method for joining semiconductor packages. The structure includes an adhesion layer, a first joint pad, a film layer with a slanted sidewall, a solder ball, and a second joint pad of a second semiconductor package.
- The structure includes an adhesion layer in contact with a first semiconductor package.
- A first joint pad is in contact with the adhesion layer.
- A film layer is disposed on the first semiconductor package and the first joint pad.
- The film layer has a slanted sidewall that covers an end portion of the adhesion layer and a first portion of the first joint pad.
- The slanted sidewall exposes a second portion of the first joint pad.
- A solder ball is attached to the second portion of the first joint pad and a second joint pad of a second semiconductor package.
Potential applications of this technology:
- Semiconductor packaging and assembly
- Electronics manufacturing
Problems solved by this technology:
- Provides a structure and method for joining semiconductor packages
- Ensures proper adhesion between packages
- Facilitates electrical connections between packages
Benefits of this technology:
- Improved reliability and performance of semiconductor packages
- Simplified manufacturing process
- Enhanced electrical connectivity between packages
Original Abstract Submitted
The present disclosure describes a structure that joins semiconductor packages and a method for forming the structure. The structure includes an adhesion layer in contact with a first semiconductor package and a first joint pad in contact with the adhesion layer. The structure further includes a film layer disposed on the first semiconductor package and the first joint pad, where the film layer includes a slanted sidewall, the slanted sidewall covers an end portion of the adhesion layer and a first portion of the first joint pad, and the slanted sidewall exposes a second portion of the first joint pad. The structure further includes a solder ball attached to the second portion of the first joint pad and a second joint pad of a second semiconductor package.
