Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES

Organization Name

intel corporation

Inventor(s)

Brandon Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Debendra Mallik of Chandler AZ (US)

Ravindranath Mahajan of Chandler AZ (US)

Rahul Manepalli of Chandler AZ (US)

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113087 titled 'HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES

Simplified Explanation

The patent application describes an apparatus comprising an interposer with glass material, redistribution layers, conductive contacts, vias, embedded integrated circuit devices, and mold material.

• The apparatus includes an interposer made of glass material.
• The interposer has redistribution layers on one surface and conductive contacts on the opposite surface.
• Vias through the interposer connect the conductive contacts with the redistribution layers.
• An integrated circuit device is embedded within a cavity in the interposer.
• The embedded integrated circuit device is connected to the redistribution layers.
• A stack of two or more integrated circuit devices is coupled with another surface of the redistribution layers.
• Mold material surrounds at least one side of the stack of integrated circuit devices.

Potential Applications

The technology described in the patent application could be used in:

• Advanced electronic devices
• High-performance computing systems
• Communication equipment

Problems Solved

This technology helps to:

• Improve the performance and reliability of integrated circuit devices
• Enhance thermal management in electronic systems

Benefits

The benefits of this technology include:

• Increased integration density
• Enhanced electrical connectivity
• Improved heat dissipation

Potential Commercial Applications

The potential commercial applications of this technology could be in:

• Semiconductor manufacturing industry
• Electronics and consumer goods market
• Telecommunications and networking sector

Possible Prior Art

One possible prior art related to this technology is the use of interposers in semiconductor packaging to improve signal integrity and reduce power consumption.

How does this technology impact the cost of manufacturing electronic devices?

The patent application does not provide information on the cost implications of implementing this technology in electronic devices.

What are the environmental implications of using mold material in the apparatus?

The environmental impact of using mold material in the apparatus is not addressed in the patent application.

Original Abstract Submitted

an apparatus is provided which comprises: an interposer comprising glass, one or more redistribution layers on a first interposer surface, one or more conductive contacts on a second interposer surface opposite the first interposer surface, one or more vias through the interposer coupling at least one of the conductive contacts on the second interposer surface with the redistribution layers on the first interposer surface, an integrated circuit device embedded within a cavity in the interposer between the first and second interposer surfaces, the embedded integrated circuit device coupled with a first redistribution layers surface, a stack of two or more integrated circuit devices coupled with a second redistribution layers surface opposite the first redistribution layers surface, and mold material surrounding at least one side of the stack of two or more integrated circuit devices. other embodiments are also disclosed and claimed.