Samsung electronics co., ltd. (20240096819). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096819 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract aims to prevent warpage of an interposer to enhance product reliability. The package includes a first substrate with a first insulating layer and a first conductive pattern, a semiconductor chip on the first substrate, and an interposer on the semiconductor chip. The interposer consists of a second insulating layer, a second conductive pattern, and a support member with a first lower pad, a bump, and a first connection member connecting the first and second conductive patterns.
- Explanation of the patent:
* Semiconductor package designed to prevent interposer warpage for improved reliability. * Includes a support member with a bump and connection member for secure connections between layers. * Utilizes insulating layers and conductive patterns for proper functioning of the package.
Potential Applications
The technology described in this patent application could be applied in various semiconductor packaging industries, such as:
- Consumer electronics
- Automotive electronics
- Industrial automation
Problems Solved
The technology addresses the following issues:
- Warpage of the interposer
- Reliability concerns in semiconductor packages
- Ensuring secure connections between layers
Benefits
The benefits of this technology include:
- Improved product reliability
- Enhanced performance of semiconductor packages
- Secure connections for better functionality
Potential Commercial Applications
The technology could find commercial applications in:
- Semiconductor manufacturing companies
- Electronics component suppliers
- Research and development firms
Possible Prior Art
One possible prior art in this field could be the use of additional support structures to prevent warpage in semiconductor packages. However, the specific design and configuration of the support member with a bump and connection member as described in this patent application may be novel and inventive.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this technology compared to existing solutions. Further research or analysis would be needed to determine the cost-effectiveness of this innovation.
What are the environmental impacts of using this technology in semiconductor packaging?
The environmental implications of using this technology, such as the materials used in the package and the disposal/recycling process, are not addressed in the article. Additional studies or assessments would be required to evaluate the environmental footprint of this innovation.
Original Abstract Submitted
there is provided a semiconductor package in which warpage of an interposer is prevented to improve product reliability. the semiconductor package comprising a first substrate including a first insulating layer, and a first conductive pattern disposed in the first insulating layer, a semiconductor chip disposed on the first substrate, an interposer disposed on the semiconductor chip, wherein the interposer includes a second insulating layer, and a second conductive pattern disposed in the second insulating layer, a support member disposed on a bottom surface of the second insulating layer and is in contact with an upper surface of the semiconductor chip, wherein the support member includes a first lower pad and a bump disposed under the first lower pad and a first connection member disposed between the first substrate and the interposer so as to connect the first conductive pattern and the second conductive pattern to each other.
