17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES

Organization Name

Intel Corporation

Inventor(s)

Brandon Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Jeremy Ecton of Gilbert AZ (US)

Debendra Mallik of Chandler AZ (US)

Ravindranath Mahajan of Chandler AZ (US)

Rahul Manepalli of Chandler AZ (US)

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17957403 titled 'HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES

Simplified Explanation

The patent application describes an apparatus that includes an interposer made of glass, redistribution layers, conductive contacts, vias, embedded integrated circuit devices, and mold material.

• The apparatus includes an interposer made of glass.
• The interposer has redistribution layers on one surface and conductive contacts on the opposite surface.
• Vias through the interposer connect the conductive contacts with the redistribution layers.
• Integrated circuit devices are embedded within a cavity in the interposer.
• The embedded integrated circuit devices are coupled with redistribution layers.
• A stack of integrated circuit devices is coupled with another surface of the interposer.
• Mold material surrounds the stack of integrated circuit devices.

Potential Applications

The technology described in the patent application could be applied in the semiconductor industry for the development of advanced packaging solutions.

Problems Solved

This technology solves the problem of efficiently integrating multiple integrated circuit devices in a compact and reliable manner.

Benefits

The benefits of this technology include improved performance, reduced footprint, enhanced reliability, and cost-effectiveness in semiconductor packaging.

Potential Commercial Applications

The potential commercial applications of this technology could be in the fields of consumer electronics, telecommunications, automotive, and industrial automation.

Possible Prior Art

One possible prior art for this technology could be the use of multi-chip modules in semiconductor packaging.

What are the specific materials used in the apparatus described in the patent application?

The specific materials used in the apparatus described in the patent application are glass for the interposer, conductive materials for the redistribution layers and contacts, and mold material for encapsulation.

How does the embedded integrated circuit device interact with the redistribution layers in the interposer?

The embedded integrated circuit device is coupled with a surface of the redistribution layers in the interposer, allowing for electrical connections and signal transmission between the integrated circuit device and the rest of the apparatus.

Original Abstract Submitted

An apparatus is provided which comprises: an interposer comprising glass, one or more redistribution layers on a first interposer surface, one or more conductive contacts on a second interposer surface opposite the first interposer surface, one or more vias through the interposer coupling at least one of the conductive contacts on the second interposer surface with the redistribution layers on the first interposer surface, an integrated circuit device embedded within a cavity in the interposer between the first and second interposer surfaces, the embedded integrated circuit device coupled with a first redistribution layers surface, a stack of two or more integrated circuit devices coupled with a second redistribution layers surface opposite the first redistribution layers surface, and mold material surrounding at least one side of the stack of two or more integrated circuit devices. Other embodiments are also disclosed and claimed.