Kioxia corporation (20240099013). SEMICONDUCTOR MEMORY DEVICE simplified abstract

SEMICONDUCTOR MEMORY DEVICE

Organization Name

kioxia corporation

Inventor(s)

Yoshiaki Fukuzumi of Yokkaichi (JP)

Hideaki Aochi of Yokkaichi (JP)

Mie Matsuo of Yokkaichi (JP)

Kenichiro Yoshii of Bunkyo (JP)

Koichiro Shindo of Yokohama (JP)

Kazushige Kawasaki of Kawasaki (JP)

Tomoya Sanuki of Yokkaichi (JP)

SEMICONDUCTOR MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240099013 titled 'SEMICONDUCTOR MEMORY DEVICE

Simplified Explanation

The patent application describes a technology where an array chip and a circuit chip are connected together using a bonding metal between their respective interconnection layers.

• Three-dimensionally disposed memory cells in the array chip
• Memory-side interconnection layer connected to memory cells
• Control circuit on the substrate of the circuit chip
• Circuit-side interconnection layer on the control circuit
• Bonding metal between memory-side and circuit-side interconnection layers

Potential Applications

This technology could be applied in:

• Memory devices
• Integrated circuits
• Semiconductor industry

Problems Solved

This technology helps in:

• Improving connectivity between array and circuit chips
• Enhancing performance of memory systems
• Facilitating compact design of electronic devices

Benefits

The benefits of this technology include:

• Increased data transfer speeds
• Higher efficiency in memory operations
• Reduction in overall size of electronic devices

Potential Commercial Applications

Potential commercial applications of this technology could be seen in:

• Consumer electronics
• Data storage devices
• Communication systems

Possible Prior Art

One possible prior art could be the use of bonding metals in semiconductor packaging to improve connectivity between different components.

What materials are commonly used as bonding metals in semiconductor packaging?

Commonly used materials for bonding metals in semiconductor packaging include gold, copper, and aluminum.

How does the three-dimensional disposition of memory cells impact the overall performance of the memory device?

The three-dimensional disposition of memory cells allows for higher memory density and faster data access, leading to improved performance of the memory device.

Original Abstract Submitted

according to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected to the memory cells. the circuit chip includes a substrate, a control circuit provided on the substrate, and a circuit-side interconnection layer provided on the control circuit and connected to the control circuit. the circuit chip is stuck to the array chip with the circuit-side interconnection layer facing to the memory-side interconnection layer. the bonding metal is provided between the memory-side interconnection layer and the circuit-side interconnection layer. the bonding metal is bonded to the memory-side interconnection layer and the circuit-side interconnection layer.