17894095. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Tzuan-Horng Liu of Taoyuan City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17894095 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor package described in the patent application includes multiple components such as redistribution structures, dies, encapsulants, conductive connectors, and more. Here is a simplified explanation of the abstract:

• A first redistribution structure and a second redistribution structure are present in the semiconductor package.
• A first die is located between the first and second redistribution structures.
• The first die is encapsulated laterally by a first encapsulant.
• A second die is placed on and connected to the second redistribution structure.
• The second die is encapsulated laterally by a second encapsulant with conductive connectors embedded in it.
• A third die is positioned over the second die, in contact with the second encapsulant and conductive connectors.

Potential Applications:

• Advanced semiconductor packaging for electronic devices
• High-performance computing systems
• Automotive electronics
• Aerospace technology

Problems Solved:

• Improved thermal management in semiconductor packages
• Enhanced electrical connectivity and signal transmission
• Increased reliability and durability of electronic components

Benefits:

• Higher efficiency and performance of electronic devices
• Compact and space-saving design
• Enhanced overall system reliability
• Improved heat dissipation capabilities

Original Abstract Submitted

A semiconductor package includes a first redistribution structure, a second redistribution structure, a first die, a first encapsulant, a second die, a second encapsulant, conductive connectors, and a third die. The second redistribution structure is over the first redistribution structure. The first die is located between the first redistribution structure and the second redistribution structure. The first encapsulant laterally encapsulates the first die. The second die is disposed on and electrically connected to the second redistribution structure. The second encapsulant laterally encapsulates the second die. The conductive connectors surround the second die and are embedded in the second encapsulant. The third die is disposed over the second die. The third die is in physical contact with the second encapsulant and the conductive connectors.