Taiwan semiconductor manufacturing co., ltd. (20240096812). Semiconductor Device and Method of Manufacture simplified abstract
Contents
- 1 Semiconductor Device and Method of Manufacture
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Semiconductor Device and Method of Manufacture
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chien-Hsun Lee of Chu-tung Town (TW)
Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096812 titled 'Semiconductor Device and Method of Manufacture
Simplified Explanation
The method described in the abstract involves encapsulating a tested semi-finished substrate in two different encapsulants, arranging semiconductor dies on the substrate, electrically coupling the dies to the substrate, and bonding external contacts to the substrate after removing a carrier substrate.
- Tested semi-finished substrate is arranged on a carrier substrate
- Semi-finished substrate is encapsulated in a first encapsulant
- At least one semiconductor die is placed on the semi-finished substrate
- Semiconductor components of the die are electrically coupled to the substrate
- Die and portions of the first encapsulant are encased in a second encapsulant
- Carrier substrate is removed from the semi-finished substrate
- Plurality of external contacts are bonded to the semi-finished substrate
Potential Applications
The technology described in this patent application could be applied in the manufacturing of various semiconductor devices such as integrated circuits, sensors, and microprocessors.
Problems Solved
This technology solves the problem of efficiently and reliably assembling semiconductor devices by using a tested semi-finished substrate as a base and encapsulating it to protect the components during further processing.
Benefits
The benefits of this technology include improved reliability of semiconductor devices, simplified manufacturing processes, and potentially lower production costs due to the reuse of tested substrates.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for the production of a wide range of electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of temporary carrier substrates in semiconductor manufacturing processes to protect and handle delicate components during assembly.
Unanswered Questions
How does this technology compare to traditional methods of semiconductor device assembly?
This article does not provide a direct comparison between this innovative method and traditional methods of semiconductor device assembly. It would be interesting to know the specific advantages and disadvantages of this new approach compared to established techniques.
What are the specific materials used for the encapsulants in this method?
The abstract mentions the use of two different encapsulants, but it does not specify the exact materials used. Understanding the properties and characteristics of these encapsulants could provide insights into the performance and reliability of the semiconductor devices produced using this method.
Original Abstract Submitted
a method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.
