18536332. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Kwangjin Moon of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18536332 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor chip with an integrated circuit, and a second structure on top of it. The second structure consists of a second semiconductor chip with an integrated circuit, a semiconductor pattern, an insulating pattern, and through-electrode structures. The through-electrode structures penetrate through either the second semiconductor chip or the semiconductor pattern. The semiconductor pattern is positioned next to the second semiconductor chip, with one side facing it and the other side aligned with the first semiconductor chip.
- The semiconductor package includes a first semiconductor chip with an integrated circuit and a second structure with a second semiconductor chip and through-electrode structures.
- The through-electrode structures penetrate through either the second semiconductor chip or the semiconductor pattern.
- The semiconductor pattern is positioned next to the second semiconductor chip, with one side facing it and the other side aligned with the first semiconductor chip.
Potential Applications
This technology could be applied in:
- Advanced electronic devices
- High-performance computing systems
- Communication equipment
Problems Solved
This technology helps to:
- Increase integration density
- Improve electrical connectivity
- Enhance overall performance of semiconductor packages
Benefits
The benefits of this technology include:
- Enhanced functionality
- Improved reliability
- Higher efficiency in electronic devices
Potential Commercial Applications
Potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive industry
- Aerospace sector
Possible Prior Art
One possible prior art could be the use of through-electrode structures in semiconductor packages to improve electrical connectivity and integration density.
Unanswered Questions
How does this technology impact power consumption in electronic devices?
This article does not address the specific impact of this technology on power consumption in electronic devices.
What are the potential challenges in manufacturing semiconductor packages with through-electrode structures?
The article does not discuss the potential challenges that may arise during the manufacturing process of semiconductor packages with through-electrode structures.
Original Abstract Submitted
A semiconductor package includes a first structure including a first semiconductor chip comprising a first semiconductor integrated circuit, and a second structure on the first structure. The second structure includes a second semiconductor chip including a second semiconductor integrated circuit, a semiconductor pattern horizontally spaced apart from the second semiconductor chip and on a side surface of the second semiconductor chip, an insulating pattern between the second semiconductor chip and the semiconductor pattern, and through-electrode structures. At least one of the through-electrode structures penetrates through at least a portion of the second semiconductor chip or penetrates through the semiconductor pattern. The semiconductor pattern has a first side surface facing the side surface of the second semiconductor chip and a second side surface opposing the first side surface. The second side surface of the semiconductor pattern is vertically aligned with a side surface of the first semiconductor chip.
