SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240120315 titled 'SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Simplified Explanation

The semiconductor package described in the abstract includes multiple semiconductor dies that are electrically coupled through a semiconductor bridge. The bridge overlaps the corners of the adjacent dies, allowing for efficient electrical connection between them.

The semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent to each other.
A semiconductor bridge overlaps a corner of the first semiconductor die and a corner of the second semiconductor die, electrically coupling them.
A third semiconductor die and a fourth semiconductor die are also included, electrically coupled to the first and second semiconductor dies, respectively.
The semiconductor bridge is interposed between the third and fourth semiconductor dies.

Potential Applications

The technology described in this patent application could be applied in:

Multi-chip modules
High-density integrated circuits
Power electronics

Problems Solved

This technology helps solve issues related to:

Efficient electrical coupling between multiple semiconductor dies
Space constraints in semiconductor packaging
Improving signal integrity in complex electronic systems

Benefits

The benefits of this technology include:

Enhanced performance of integrated circuits
Increased reliability of semiconductor packages
Simplified manufacturing processes

Potential Commercial Applications

The potential commercial applications of this technology could be in:

Consumer electronics
Automotive electronics
Telecommunications equipment

Possible Prior Art

One possible prior art for this technology could be the use of wire bonding or flip-chip technology to connect multiple semiconductor dies in a package.

Unanswered Questions

How does the semiconductor bridge ensure reliable electrical connection between the adjacent semiconductor dies?

The semiconductor bridge likely utilizes conductive materials to establish a secure electrical connection between the dies, but the specific design and materials used are not detailed in the abstract.

What are the potential challenges in manufacturing semiconductor packages with multiple dies and a semiconductor bridge?

Manufacturing processes for complex semiconductor packages may involve precise alignment and bonding techniques, as well as considerations for thermal management and electrical performance. These challenges are not explicitly addressed in the abstract.

Original Abstract Submitted

a semiconductor package includes a first semiconductor die and a second semiconductor die disposed laterally adjacent one another. the semiconductor package includes a semiconductor bridge overlapping a first corner of the first semiconductor die and a second corner of the second semiconductor die. the semiconductor bridge electrically couples the first semiconductor to the second semiconductor die. the semiconductor package includes a third semiconductor die and a fourth semiconductor die electrically coupled to the first semiconductor die and the second semiconductor die, respectively. the semiconductor bridge is interposed between the third semiconductor die and the fourth semiconductor die.

Taiwan semiconductor manufacturing company, ltd. (20240120315). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract

Contents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Organization Name

Inventor(s)