17823157. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hung-Pin Chang of New Taipei City (TW)
Chien-Chia Chiu of Zhongli City (TW)
Cheng-Hung Lin of New Taipei City (TW)
SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17823157 titled 'SEMICONDUCTOR PACKAGE AND METHOD
Simplified Explanation
The semiconductor package includes a ring structure with one or more indents, a substrate, a first package component with a semiconductor die, and a lid structure.
- The ring structure encircles the first package component in a top view.
- The ring structure includes a first segment along a first edge of the substrate and a second segment along a second edge of the substrate.
- The first segment and the second segment meet at a first corner of the ring structure.
- A first indent is disposed at the first corner of the ring structure.
- Potential Applications:**
- Semiconductor packaging industry
- Electronics manufacturing
- Problems Solved:**
- Providing structural support and protection for semiconductor components
- Enhancing the overall reliability and durability of semiconductor packages
- Benefits:**
- Improved structural integrity
- Enhanced protection for semiconductor components
- Increased reliability of semiconductor packages
Original Abstract Submitted
A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.
