18204970. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR PACKAGE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sangwoong Lee of Suwon-si (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18204970 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The semiconductor package described in the patent application includes a first redistribution structure, a first semiconductor chip, an encapsulant, first conductive posts, a heat dissipation member, and a second semiconductor chip. The first semiconductor chip overlaps the first conductive posts in one direction, while the second semiconductor chip does not overlap the first semiconductor chip in that direction.

  • The semiconductor package includes a first redistribution structure, a first semiconductor chip, an encapsulant, first conductive posts, a heat dissipation member, and a second semiconductor chip.
  • The first semiconductor chip overlaps the first conductive posts in one direction, while the second semiconductor chip does not overlap the first semiconductor chip in that direction.

Potential Applications

This technology could be applied in:

  • High-performance computing
  • Automotive electronics
  • Telecommunications

Problems Solved

This technology helps to:

  • Improve heat dissipation in semiconductor packages
  • Enhance electrical connectivity between components
  • Increase overall package reliability

Benefits

The benefits of this technology include:

  • Better thermal management
  • Enhanced electrical performance
  • Improved overall package durability

Potential Commercial Applications

This technology could be commercially applied in:

  • Data centers
  • Automotive industry
  • Consumer electronics

Possible Prior Art

One possible prior art for this technology could be:

  • Existing semiconductor packaging techniques
  • Previous methods for heat dissipation in electronic devices

Unanswered Questions

What materials are used in the heat dissipation member?

The patent application does not specify the materials used in the heat dissipation member. Further research or examination of the full patent document may provide more details on this aspect.

How does the encapsulant affect the overall performance of the semiconductor package?

The abstract mentions the encapsulant, but it does not delve into how it impacts the performance of the semiconductor package. Further investigation or analysis of the full patent application may shed light on this aspect.


Original Abstract Submitted

A semiconductor package includes a first redistribution structure, a first semiconductor chip disposed on an upper surface of the first redistribution structure, an encapsulant disposed between the first redistribution structure and the first semiconductor chip, a plurality of first conductive posts electrically connecting the first redistribution structure and the first semiconductor chip with each other, and penetrating through the encapsulant in a first direction, a heat dissipation member having at least a portion that overlaps the first semiconductor chip in a second direction that is perpendicular to the first direction, and a second semiconductor chip disposed between the first redistribution structure and the heat dissipation member, and encapsulated by the encapsulant. The first semiconductor chip overlaps the plurality of first conductive posts in the first direction. The first semiconductor chip does not overlap the second semiconductor chip in the first direction.