18241592. FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH simplified abstract (MICRON TECHNOLOGY, INC.)
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
Organization Name
Inventor(s)
Jong Sik Paek of Taichung (TW)
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH - A simplified explanation of the abstract
This abstract first appeared for US patent application 18241592 titled 'FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
Simplified Explanation
The patent application describes semiconductor device assemblies that consist of a substrate with a substrate contact, a first semiconductor device, and a second semiconductor device arranged face-to-face. The assemblies also include a fan-out porch on the substrate with a wirebond contact that is electrically connected to the first semiconductor device. A wirebond connects the wirebond contact to the substrate contact, and a pillar or bump connects the active side of the first semiconductor device to the active side of the second semiconductor device. In some cases, the wirebond contact is connected to the active side of the first semiconductor device.
- Semiconductor device assemblies with a substrate, first and second semiconductor devices, and a fan-out porch.
- The assemblies have a wirebond contact on the fan-out porch, electrically connected to the first semiconductor device.
- A wirebond connects the wirebond contact to the substrate contact.
- A pillar or bump connects the active side of the first semiconductor device to the active side of the second semiconductor device.
- In some cases, the wirebond contact is connected to the active side of the first semiconductor device.
Potential Applications
- Integrated circuits
- Microprocessors
- Memory devices
- Power electronics
Problems Solved
- Improved electrical connectivity between semiconductor devices
- Enhanced integration and miniaturization of semiconductor assemblies
- Increased performance and functionality of semiconductor devices
Benefits
- Improved signal transmission and reduced signal loss
- Higher density and compactness of semiconductor assemblies
- Enhanced performance and functionality of semiconductor devices
- Cost-effective manufacturing processes
Original Abstract Submitted
Semiconductor device assemblies can include a substrate having a substrate contact. The assemblies can include a first semiconductor device and a second semiconductor device arranged in a face-to-face configuration. The assemblies can include a fan-out porch on the substrate at a lateral side of the first semiconductor device and including a wirebond contact, the wirebond contact being electrically coupled to the first semiconductor device. The assemblies can include a wirebond operably coupling the wirebond contact to the substrate contact. The assemblies can include a pillar or bump operably coupling the active side of the first semiconductor device to the active side of the second semiconductor device. In some embodiments, the wirebond contact is operably couple to the active side of the first semiconductor device.
