Intel corporation (20240128253). LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract
Contents
- 1 LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL
Organization Name
Inventor(s)
Denis Myasishchev of Chandler AZ (US)
Andrew V. Mazur of Tempe AZ (US)
Purushotham Kaushik Muthur Srinath of Chandler AZ (US)
Robert M. Nickerson of Chandler AZ (US)
Shripad Gokhale of Gilbert AZ (US)
LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128253 titled 'LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL
Simplified Explanation
The abstract describes an electronic package with a mold layer, embedded die, and solder resist with cavities.
- The electronic package includes a mold layer and a die embedded within it.
- A solder resist is present with a first surface over the mold layer and a second surface with cavities.
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in protecting the embedded die and ensuring proper functioning of the electronic package by providing a protective layer and cavities for components.
Benefits
The benefits of this technology include improved durability, protection of sensitive components, and enhanced performance of electronic devices.
Potential Commercial Applications
The technology could be applied in the manufacturing of electronic devices, leading to more reliable and robust products in the market.
Possible Prior Art
One possible prior art could be the use of traditional electronic packaging methods without the specific features described in this patent application.
Unanswered Questions
How does this technology compare to existing electronic packaging methods?
This technology offers improved protection and performance for electronic packages compared to traditional methods.
What are the specific dimensions and materials used in the electronic package described in the patent application?
The patent application does not provide detailed information on the specific dimensions and materials used in the electronic package.
Original Abstract Submitted
embodiments disclosed herein include electronic packages. in an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. in an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. in an embodiment, the second surface comprises a first cavity into the solder resist.
