20240038633. EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS simplified abstract (Invensas Bonding Technologies, Inc.)

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EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS

Organization Name

Invensas Bonding Technologies, Inc.

Inventor(s)

Belgacem Haba of Saratoga CA (US)

Thomas Workman of San Jose CA (US)

Cyprian Emeka Uzoh of San Jose CA (US)

Guilian Gao of Campbell CA (US)

Rajesh Katkar of Milpitas CA (US)

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240038633 titled 'EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOLING SYSTEMS

Simplified Explanation

The abstract describes embodiments of a patent application related to fluidic cooling assemblies embedded within a device package and their manufacturing methods. In one embodiment, the cooling assembly consists of a cold plate body attached to a singulated device and a manifold lid attached to the cold plate body. The cold plate body has a first side adjacent to the singulated device and a second side opposite to it, and the manifold lid is attached to the second side. The cold plate body and the backside of the singulated device may have dielectric material surfaces, and they are attached through direct dielectric bonds. The cold plate body and the manifold lid define one or more cavities, which form a fluid flow path from an inlet to an outlet of the manifold lid.

  • The patent application describes a cooling assembly embedded within a device package.
  • The cooling assembly includes a cold plate body attached to a singulated device and a manifold lid attached to the cold plate body.
  • The cold plate body and the backside of the singulated device have dielectric material surfaces.
  • The cold plate body is attached to the singulated device through direct dielectric bonds.
  • The cold plate body and the manifold lid define one or more cavities.
  • The cavities form a fluid flow path from an inlet to an outlet of the manifold lid.

Potential applications of this technology:

  • Electronics cooling: The fluidic cooling assembly can be used to efficiently cool electronic devices, such as processors, integrated circuits, or power modules.
  • Data centers: The technology can be applied in data centers to enhance the cooling of servers and other equipment, improving their performance and reliability.
  • Electric vehicles: The cooling assembly can be utilized in electric vehicles to cool high-power components, such as batteries or electric motors, ensuring their optimal operation and longevity.

Problems solved by this technology:

  • Heat dissipation: The fluidic cooling assembly solves the problem of efficiently dissipating heat generated by electronic devices, preventing overheating and potential damage.
  • Size constraints: By embedding the cooling assembly within the device package, it eliminates the need for external cooling systems, allowing for more compact and space-efficient designs.
  • Thermal management: The technology addresses the challenge of managing thermal issues in high-performance electronic systems, ensuring their reliable operation under demanding conditions.

Benefits of this technology:

  • Improved cooling efficiency: The fluidic cooling assembly provides efficient heat transfer, allowing for effective cooling of electronic devices and reducing the risk of thermal damage.
  • Compact design: By integrating the cooling assembly within the device package, it enables smaller and more compact electronic systems, saving space and facilitating integration.
  • Enhanced reliability: Effective thermal management provided by the technology improves the reliability and lifespan of electronic devices, reducing the risk of failures and malfunctions.


Original Abstract Submitted

embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. in one embodiment, the cooling assembly includes a cold plate body attached to a singulated device and a manifold lid attached to the cold plate body. the cold plate body has a first side adjacent to the singulated device and an opposite second side, and the manifold lid is attached to the second side. in some embodiments, the first side of the cold plate body and the backside of the singulated device each comprise a dielectric material surface, the cold plate body is attached to the singulated device by direct dielectric bonds formed between the dielectric material surfaces, the cold plate body, and the manifold lid define one or more cavities, and the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.

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