Qualcomm incorporated (20240105760). INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD simplified abstract
Contents
- 1 INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
Organization Name
Inventor(s)
Je-Hsiung Lan of San Diego CA (US)
Jonghae Kim of San Diego CA (US)
Jui-Yi Chiu of Taichung City (TW)
Nosun Park of San Diego CA (US)
INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105760 titled 'INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
Simplified Explanation
The device described in the patent application includes a substrate with a cavity, a redistribution layer on the sidewalls and base of the cavity, and a fill material within the cavity.
- The device has a substrate with a cavity for housing components.
- A redistribution layer is present on the sidewalls and base of the cavity, as well as on a surface of the substrate.
- The cavity is filled with a material to protect and support the components.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Microelectronics
- MEMS devices
- Sensor technology
Problems Solved
This technology helps solve the following problems:
- Protecting delicate components within a device
- Ensuring proper connectivity and signal transmission
- Enhancing the overall reliability and durability of the device
Benefits
The benefits of this technology include:
- Improved performance and longevity of devices
- Enhanced protection for sensitive components
- Increased efficiency in signal transmission
Potential Commercial Applications
The technology described in this patent application could be commercially applied in:
- Consumer electronics
- Automotive industry
- Aerospace sector
Possible Prior Art
One possible prior art for this technology could be the use of redistribution layers in microelectronics and semiconductor devices to improve connectivity and performance.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of implementing this technology compared to existing solutions.
What are the environmental implications of using this technology?
The article does not address the potential environmental impact of using this technology.
Original Abstract Submitted
a device is described. the device includes a substrate having a first cavity. the device also includes a first redistribution layer (rdl) on sidewalls and a base of the first cavity in the substrate and on a first surface of the substrate. the device further includes a fill material in the first cavity.
