18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
Contents
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
Organization Name
Inventor(s)
Chonghua Zhong of Cupertino CA (US)
Kunzhong Hu of Cupertino CA (US)
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18156287 titled 'HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
Simplified Explanation
The abstract describes a package structure with folded die arrangements and methods of fabrication. Here is a simplified explanation of the abstract:
- The package structure includes a first die and a vertical interposer placed side by side.
- A second die is positioned face down and electrically connected to the vertical interposer.
- A local interposer is used to electrically connect the first die with the vertical interposer.
Potential applications of this technology:
- Integrated circuits and semiconductor devices
- Electronics manufacturing and packaging industry
Problems solved by this technology:
- Efficient utilization of space in package structures
- Improved electrical connectivity between multiple dies
Benefits of this technology:
- Compact package structure design
- Enhanced electrical performance and connectivity
- Cost-effective fabrication methods
Original Abstract Submitted
Package structure with folded die arrangements and methods of fabrication are described. In an embodiment, a package structure includes a first die and vertical interposer side-by-side. A second die is face down on an electrically connected with the vertical interposer, and a local interposer electrically connects the first die with the vertical interposer.
