Taiwan semiconductor manufacturing company, ltd. (20240105530). Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same simplified abstract
Contents
- 1 Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wensen Hung of Zhubei City (TW)
Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105530 titled 'Integrated Circuit Packages, Devices Using the Same, and Methods of Forming the Same
Simplified Explanation
The abstract describes a device with an integrated circuit package, a package stiffener, and a heat spreader attached to the package. The heat spreader has a main portion above the package stiffener and a protruding portion extending through it. An elastic adhesive material is between the main portion of the heat spreader and the package stiffener, while a thermal interface material is between the protruding portion of the heat spreader and the package component.
- Integrated circuit package with package stiffener and heat spreader
- Elastic adhesive material between heat spreader and package stiffener
- Thermal interface material between heat spreader and package component
Potential Applications
This technology could be applied in various electronic devices that require efficient heat dissipation, such as computers, smartphones, and servers.
Problems Solved
1. Improved heat dissipation in electronic devices 2. Enhanced reliability and performance of integrated circuits
Benefits
1. Increased thermal efficiency 2. Enhanced device longevity 3. Improved overall performance
Potential Commercial Applications
Optimizing Heat Dissipation in Electronic Devices
Possible Prior Art
Prior art may include similar technologies used in electronic devices for heat dissipation, such as heat sinks and thermal interface materials.
Unanswered Questions
How does this technology compare to traditional heat dissipation methods?
This article does not provide a direct comparison between this technology and traditional heat dissipation methods. Further research or testing may be needed to determine the advantages and disadvantages of this innovation.
What is the cost-effectiveness of implementing this technology in mass-produced electronic devices?
The article does not address the cost implications of integrating this technology into commercial products. A cost-benefit analysis would be necessary to evaluate the economic feasibility of widespread adoption.
Original Abstract Submitted
in an embodiment, a device includes: an integrated circuit package including: a package component; and a package stiffener attached to the package component; and a heat spreader attached to the integrated circuit package, a main portion of the heat spreader disposed above the package stiffener, a protruding portion of the heat spreader extending through the package stiffener; an elastic adhesive material between the main portion of the heat spreader and the package stiffener; and a thermal interface material between the protruding portion of the heat spreader and the package component, the thermal interface material different from the elastic adhesive material.
