17901386. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17901386 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The patent application describes a semiconductor device that includes a substrate with a recess region. The device also includes a first electrode with a three-dimensional network structure, a first dielectric layer covering the first electrode, a second electrode covering the first dielectric layer, and a molding layer filling the remaining portion of the recess region and covering the second electrode.
- The first electrode has a unique three-dimensional network structure.
- The first dielectric layer provides insulation for the first electrode.
- The second electrode covers the first dielectric layer.
- The molding layer fills the remaining recess region and covers the second electrode.
Potential Applications
- This semiconductor device can be used in various electronic devices such as smartphones, computers, and tablets.
- It can be utilized in power electronics, integrated circuits, and sensors.
Problems Solved
- The three-dimensional network structure of the first electrode provides improved electrical conductivity and performance.
- The first dielectric layer ensures proper insulation and protection for the first electrode.
- The molding layer enhances the structural integrity and stability of the device.
Benefits
- Enhanced electrical conductivity and performance due to the unique three-dimensional network structure of the first electrode.
- Improved insulation and protection provided by the first dielectric layer.
- Increased structural integrity and stability of the device with the help of the molding layer.
Original Abstract Submitted
A semiconductor device includes a substrate having a recess region, a first electrode in the recess region and having a three-dimensional network structure, a first dielectric layer in the recess region and covering the first electrode, a second electrode in the recess region and covering the first dielectric layer, and a molding layer filling a remaining portion of the recess region and covering the second electrode.
