Samsung display co., ltd. (20240128224). ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract
Contents
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE
Organization Name
Inventor(s)
Jung Hoon Shin of Seongnam-si (KR)
Hyuk Hwan Kim of Suwon-si (KR)
Byoung Dae Ye of Yongin-si (KR)
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128224 titled 'ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE
Simplified Explanation
The adhesive member described in the patent application consists of a conductive particle layer, a non-conductive layer, and a screening layer with spaced-apart screening members.
- Conductive particle layer: Contains multiple conductive particles.
- Non-conductive layer: Positioned on top of the conductive particle layer.
- Screening layer: Located between the conductive particle layer and the non-conductive layer, consisting of several screening members spaced apart from each other.
- Potential Applications:**
This technology could be applied in electronic devices, medical devices, and industrial equipment where adhesion with conductivity is required.
- Problems Solved:**
This innovation solves the issue of achieving adhesion while maintaining conductivity in various applications.
- Benefits:**
The adhesive member provides a reliable and durable solution for bonding materials that require both adhesion and conductivity.
- Potential Commercial Applications:**
"Conductive Particle Layer Adhesive Technology for Electronic Devices and Industrial Equipment"
- Possible Prior Art:**
There may be prior art related to conductive adhesives or materials used for bonding in electronic devices or industrial applications.
- Unanswered Questions:**
- 1. What is the cost-effectiveness of implementing this technology compared to traditional methods?**
The cost-effectiveness of using this adhesive member compared to other bonding techniques is not addressed in the abstract.
- 2. Are there any limitations to the size or shape of the materials that can be bonded using this technology?**
The abstract does not mention any restrictions on the size or shape of materials that can be bonded with this adhesive member.
Original Abstract Submitted
an adhesive member includes: a conductive particle layer including a plurality of conductive particles; a non-conductive layer disposed on the conductive particle layer; and a screening layer interposed between the conductive particle layer and the non-conductive layer and includes a plurality of screening members spaced apart from each other.
